Distributed Motion Controller | Motion Control

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High Scalability, Abundant I/O Support and Flexible Configuration

As smart factories continue to expand the scale of their operations, more reliable and stable motion control axes and I/O points are required to meet the growing demand of adding more connected equipment. Other than centralized motion controllers, ADLINK provides complete and scalable distributed motion control solutions for machine automation for improved system expansion by supporting more than 256 axes and over 2000 I/O points with wiring that exceeds 100 meters for large-scale motion control automation such as electronic parts manufacturing.

ADLINK’s distributed motion control solutions offer PCI/PCIe control interfaces to support Ethernet-based and MotionNet protocols, bringing flexible configuration options for customers to build motion control system based on the communication protocol of existing equipment.

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MotionNet Master Controller
MotionNet Slave System
Ethernet-based
Software Support

Application Story

Die Sorting
Probe Testing
Laser Dicing
Die Bonding

ADLINK Introduces a High-Efficiency Die Sorting Solution to Overcome Packaging and Testing Bottlenecks

To perform the quality inspections of dies, manufacturers are always looking for ways to significantly increase sorting efficiency, so that good dies can be more quickly sorted from faulty ones. As semiconductor manufacturing continues to evolve, die sizes have become increasingly smaller while the number of units that need to be tested has conversely grown exponentially. ADLINK's sorting solution integrates both image acquisition cards and motion control cards, allowing end users to easily achieve rapid feedback response, striking the optimal balance between speed and accuracy.

ADLINK’s Probe Test Solution Greatly Improves the Speed and Accuracy of IC Electrical Measurement

The process of probe testing comprises a series of up and down movements of the probe head as it comes into contact with the silicon wafer. Good probe testing is predicated on good motion control. ADLINK integrates an analog input function into the motion control card, effectively preventing the probe from moving abnormally.

A silicon wafer might have thousands of points to be tested. ADLINK's probe testing solution enables the probe to moving quickly and with stability, while reducing the total amount of time needed for the testing process.

Technological Break-through for Semiconductor Laser Dicing

Contemporary chip designs tend to be lighter, thinner, and have three-dimensional heterogeneous integration, with cuts that are becoming more complex. A few of the current challenges for laser dicing include: poor accuracy, difficult to achieve high-precision motion trajectory, hard to adjust laser power, time-consuming speed planning, inability to provide real-time trigger control feedback, images analysis, and motion control that cannot be fully integrated.

ADLINK's laser dicing solution integrating visual alignment and motion control achieves quick positioning while matching sensors; it can also control laser intensity, easily switch and adjust laser power, and help avoid the laser dicing system operating repeatedly in the same path.

With Its Powerful Die Bond Solution, ADLINK Helps Semiconductor Factories Accelerate Their Back-end Packaging Process

As the semiconductor miniaturization process continues to evolve and advance, ensuring that pick-and-place motions operate faster, while achieving more accurate positioning is extremely important. ADLINK has long been a trusted provider of die bond solutions, and is well versed in the operational requirements of its customers. As such, we are able evaluate the factors that may affect die bond operations for each semiconductor process conversion, and then use the most suitable technologies to eliminate any issues.

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