“Over the years, ADLINK has been a driving force behind the development of the COM Express® specification at PICMG”
The success of COM Express in the embedded market is a result of the broad respect given to the PICMG consortium. PICMG has been responsible for many other widely accepted standard form factors in the embedded industry. Over the years, ADLINK has played a leading role in the PICMG COM.0 (COM Express) subcommittee. For more than 10 years, the PICMG COM.0 subcommittee was chaired by ADLINK and the development of the specification has benefited greatly from the considerable efforts of ADLINK’s team of technical contributors.
COM Express Cooling and Thermal Design
ADLINK offers four standard thermal solutions for fast product development and integration, including heatspreader, passive heatsink, and actively cooled solution with integrated fan. Custom, application-specific thermal solutions are also offered.
COM Express Carrier Boards and Starter Kits
ADLINK offers a wide selection of COM Express carrier boards and development kits for faster and hassle-free product development, as well as a custom carrier board & system integration service.