Innovation meets backward compatibility
First of all, there are new display interfaces. The display technologies used in SoCs have evolved rapidly in recent years, leading to the addition of the new DP++ (Dual-mode DisplayPort) display interface to support resolutions up to Ultra HD/4K with 3840 × 2160 pixels. DP++ support makes DVI and HDMI displays easier to implement, because all that is required is an electrical signal level conversion from TMDS to LVDS. Also, since singlechannel LVDS in SMARC 1.1 has become dual-channel LVDS in 2.0, this interface can now drive either two low-resolution or one high-resolution display. Depending on which processor is used, the interface can support up to 1920 x 1200 pixels at 60Hz. The parallel LCD interface, on the other hand, is no longer available, as these rather simple graphics are rarely supported in high-grade ARM/x86 SoCs. Since the HDMI/DP interface remains unaltered, developers can connect up to three high resolution digital displays via modern serial display interfaces. Existing carrier boards with single channel LVDS and HDMI can be used with SMARC 2.0 just as before.
Furthermore, the number of USB interfaces has been increased significantly. The SMARC® 2.0 standard supports up to six USB 2.0 ports and two USB 3.0 interfaces. Also it supports two GbE interfaces including IEEE1588 trigger signals. Four instead of three PCIe lanes are available for platform-specific extensions, which increases the flexibility for individual function extensions. Three of these PCIe lanes are backward compatible with SMARC® 1.1. One of the two SPI buses has been upgraded to eSPI/SPI and instead of triple I2S (I2S2 for HDA option) and SPDIF, 1x I2S (for ARM designs) and 1x HDA (for x86 designs) are now supported. What has not been changed is the support of 1x SATA, 12x GPIO, 2x CAN, 1x SDIO (4bit), 4x UART, 1x HDMI, 1x SPI and 4x I2C.
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x86 and ARM-based Modules, Carrier Boards and Starter Kits
The new SMARC® 2.0 specification uses all 314 pins of the connector and represents an enhanced credit-card size computer-on-module standand
The Standardization Group for Embedded Technologies e.V. (SGET) is nearing the completion and release of the new SMARC 2.0 specification. What are the key changes for this credit-card sized Computer-on-Module standard and what is their impact on existing and new designs?