Ultra-compact Form Factor Delivering Significantly Faster NPU and GPU Performance The ADLINK COM-HPC-mMTL is a compact, high-performance COM-HPC Mini computer-on-module powered by Intel® Core™ Ultra Series 3 (Panther Lake) processors, designed to bring advanced edge AI and graphics capabilities into space-constrained systems. Measuring just
95 × 70mm, it integrates up to 16 hybrid CPU cores, a next-generation Intel® Arc™ GPU with up to 12 Xe3 cores, and an integrated Intel® NPU 5.0 delivering up to 50 TOPS of AI acceleration. With soldered LPDDR5x memory up to 64 GB, the module delivers high bandwidth, low latency, and exceptional power efficiency, making it ideal for edge AI, intelligent vision, robotics, and real-time analytics applications that demand deterministic performance in a small footprint.
Engineered for scalability and rugged deployment,
COM-HPC-mMTL offers high-speed I/O including PCIe Gen5 , USB4, multi-display support, and optional onboard NVMe storage, enabling simplified system design and fast data movement for AI-driven workloads. Industrial-grade features such as TSN Ethernet (build option), TPM 2.0, advanced manageability, and extended operating temperatures –40° C to 85° C on selected SKUs ensure reliable operation in harsh environments. Combining cutting-edge AI compute, graphics performance, and the openness of the PICMG COM-HPC ecosystem, COM-HPC-mMTL provides a future-ready platform for next-generation edge AI, robotics, industrial automation, and mission-critical embedded systems.
Specifications: -
Intel® Core™ Ultra Processor Series 3 (Panther Lake-H) at 15-65W TDP
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PICMG COM-HPC R1.2 compliant, Mini size module (95mm x 70mm)
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Intel® Arc™ Xe3 Graphics up to 120 TOPS, Intel® NPU 5.0 up to 50 TOPS
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16 PCIe lanes (up to 12 PCIe Gen5 lanes)
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Up to 64GB LPDDR5X memory, up to 8533MT/s
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USB4, DP, HDMI, eDP display options
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Industrial temperature support: -40°C to +85°C (selected SKUs)
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10 years product availability