Summary:
- Comprehensive Intel® Core™ 200S Series Processors Adoption: ADLINK integrates Intel® Core™ 200S series processors across Mini-ITX, ATX, PICMG 1.3, COM-HPC, and edge AI platforms.
- Optimized for Edge AI & Industrial Applications: Designed for gaming, industrial automation, robotics, transportation, medical imaging, AI IPC, and various AI workloads at the edge.
- High-Performance, AI-Ready Platforms: Featuring PCIe Gen5, DDR5, integrated Intel® UHD Graphics, and ruggedization for harsh environments.
ADLINK Technology Inc., a global leader in edge computing, proudly announces the launch of a comprehensive portfolio of industrial computing solutions built on Intel® Core™ 200S series processors. These new platforms deliver major gains in AI performance, energy efficiency, and I/O flexibility—empowering next-generation applications in industrial automation, infotainment, edge AI systems, and immersive computing.
The new upgrade spans form factors Mini-ITX, ATX, PICMG 1.3 boards, edge AI systems, and COM-HPC modules, engineered to leverage the hybrid-core architecture and AI-enhanced compute of the Intel® Core™ 200S series processors.
Available Now
Model |
Description |
Application Examples |
AmITX-RL-I |
Mini-ITX Embedded Board |
Tailored for self-service kiosks and automated devices. |
IMB-M47 |
Pro Series ATX Motherboard |
Suited for industrial automation, machine vision, AI inspection, data processing systems, and logistics. |
IMB-M47H |
IMB-C47 |
Value Series Industrial ATX Motherboard |
Scalable deployment for entry-level industrial control and manufacturing automation. |
IMB-C47H |
Available by the end of September
Model |
Description |
Application Examples |
DLAP-4100 |
Expandable Mini-ITX Edge AI Platform |
Real-time inference analytics in smart factory, retail, transportation, and safety-critical deployments. |
Available in 2025 Q4
Model |
Description |
Application Examples |
NuPRO-E47 |
PICMG 1.3 Full-Size SBC |
Ideal for equipment retrofits in industrial automation. |
COM-HPC-cBLS |
COM-HPC Client Type Size C Module |
Compute engine for industrial automation, test & measurement, AMR (Autonomous mobile robot), medical imaging, video broadcasting, etc. |
MVP-3100 |
High-Performance Integrated Embedded Computer |
Engineered for smart manufacturing, semiconductor, smart retail, and logistics. |
MVP-5200 |
DLAP-5200 |
High-Performance Edge AI Platform |
High-performance Edge AI platform for advanced vision analytics, robotics, and industrial automation in demanding environments. |
DLAP-8100 |
Expandable Edge AI Platform |
Suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. |
AmITX-AD-G |
Mini-ITX Embedded Board |
Gaming machines and interactive digital kiosks. |
With integrated Intel® UHD Graphics, DDR5 support, and PCIe Gen5 readiness across the new platforms, ADLINK’s Intel® Core™ 200S Series Processors-powered solutions are designed to meet the compute, connectivity, and longevity demands of edge AI and industrial applications.
By combining Intel’s newest hybrid-core architecture with our rugged, industrial-grade designs, ADLINK is giving customers a launchpad to deploy smarter and more responsive systems at the edge. From immersive gaming terminals to automation and real-time machine vision, these platforms help our customers push the boundaries of performance and reliability.
For more product information, please visit the ADLINK website.