The cExpress-RLP COM Express Type 6 Compact module from ADLINK, equipped with a 13th Gen Intel® Core™ mobile processor and soldered LPDDR5 memory, is ideal for mission-critical applications. It offers a range of Intel Core i3 / i5 / i7 SKUs (up to 6 Performance-cores and 8 Efficient-cores) and industrial-grade options, delivering superior edge IoT performance at 15W/28W/45W TDP.
The module provides support for PCIe 4.0 and soldered down LPDDR5 memory with up to 5600 MT/s, 4 display or USB4/TBT4 via DDI/LVDS and features integrated Intel® Iris Xe graphics with up to 96EUs, allowing for instantaneous on-device AI performance.
Equipped with Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the cExpress-RLP ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more. Furthermore, its compact design makes it ideal for applications where space is limited.
Specifications:
• 13th Gen Intel® Core™ mobile processor
• Up to 14 cores (6 P-cores and 8 E-cores), 20 threads
• Intel® AVX-512 VNNI, Intel® DL Boost
• Intel® Iris® Xe graphics
• 4x displays via DDI/LVDS (optional eDP, VGA) or 2x USB4/TBT4
• Up to 64GB LPDDR5, non-ECC / IBECC, at up to 5600 MT/s
• 16x PCIe Gen4, 5x PCIe Gen3 lanes
• 2.5GbE, Intel® TCC, TSN capable
• 4x USB 3.2/2.0/1.1 and 4x USB 2.0/1.1
• 8.5V to 20V wide voltage input