The release of COM Express COM.0 Revision 3.1 brings this widely-adopted Computer-on-Module form factor in line with current and future technology trends by providing support for advanced interfaces, such as PCI Express Gen 4 and USB 4. Other interfaces added include General Purpose SPI and options for MIPI-CSI and SoundWire.
COM Express Basic size Type 6 is the most popular and widely used computer-on-module form factor on the market. With pinouts closely matching the feature set of common x86 based silicon, two COM Express connectors allow for designs of up to 75 watts. The Type 6 pinout has a strong focus on multiple modern display outputs targeting applications such as medical, gaming, test and measurement and industrial automation.
The COM Express Compact Type 6 form factor is ideally suited to single chip x86 solutions (SoCs) with a power range between 5 to 20 watts. To reach this kind of low power envelopes peak performance and feature sets have been reduced compared to silicon used on the Basic size modules. Utilizing both Intel® Core™ and Atom® SoCs, Compact size modules are typically targeted at mid- and entry level applications such as transportation, robotics, edge servers, industrial control, and HMIs in the industrial and medical fields.
| Intel Xeon W (codename: Tiger Lake-H) | |
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| 9th Gen Intel Core, Xeon E (codename: Coffeelake Refresh-H) | |
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| 7th Gen Intel Core (codename: Kaby Lake) | |
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| 6th Gen Intel Core (codename: Sky Lake) | |
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| 11th Gen Intel Core (codename: Tiger Lake-H) | |
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| 7th Gen Intel Core (codename: Kabylake) | |
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| 6th Gen Intel Core (codename: Skylake) | |
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| Intel Atom E3900 series (codename: Apollolake) | |
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| Intel Atom E3800 series (codename: Baytrail) | |
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