Intel Panther Lake | Computer on Modules

Intel Core Ultra Series 3 Processors with Integrated CPU, GPU and NPU

Advanced hybrid architecture for mixed-criticality workloads

Intel® Core™ Ultra Series 3 processors, code-named Panther Lake, represent a major advancement in embedded computing by unifying high-performance CPU cores, next-generation graphics, and dedicated AI acceleration on a single platform. Built on an advanced hybrid architecture combining Performance, Efficient, and Low-Power Efficient cores, Panther Lake delivers exceptional performance per watt for demanding edge workloads. Integrated NPU 5.0 provides up to 50 TOPS of AI acceleration, while the new Intel® Xe3–based graphics architecture significantly boosts graphics and media performance, enabling advanced vision, inference, and visualization without external accelerators. Support for high-speed DDR5/LPDDR5x memory and cutting-edge I/O such as PCIe Gen5 and USB4 ensures the bandwidth and flexibility required for next-generation embedded designs.

Industrial durability and flexibility for the intelligent edge

For mission-critical computer-on-module platforms, Intel® Core™ Ultra Series 3 is engineered with reliability, determinism, and long-term deployment in mind. Features such as In-Band ECC (IBECC), advanced power and thermal management, hardware-based security, and virtualization support help ensure stable operation in always-on, safety-aware environments. Industrial-grade SKUs with extended temperature support, combined with real-time responsiveness and efficient AI offload to the NPU, make Panther Lake ideally suited for robotics, industrial automation, medical systems, transportation, and other applications where uptime, predictability, and data integrity are paramount. Together with ADLINK’s rugged module design and lifecycle support, Intel® Core™ Ultra Series 3 – based computer on modules enable scalable, dependable computing at the intelligent edge.

Kick-start your project with I-Pi development kits

To help developers kick-start their projects quickly, ADLINK offers I-Pi development kits based on the PICMG's COM Express and COM-HPC module standards. These ready-to-use kits include carrier boards, pre-integrated software, and comprehensive documentation, enabling rapid prototyping and application testing straight out of the box. With I-Pi, developers can validate hardware and AI workloads early in the design process-shortening development cycles and paving the way for seamless deployment of production-ready systems.

COM Express Type 6 Basic Modules

Express-PTL Preliminary

COM Express R3.1 Type 6 Basic size Module based on Intel® Core™ Ultra Processor Series 3

DATA SHEET

COM Express Type 6 Carrier Boards

Express-BASE6 R3.1

COM Express® Type 6 R3.1 Reference Carrier Board in ATX Form Factor

DATA SHEET

COM-HPC Mini Modules

COM-HPC-mPTL Preliminary

COM-HPC R1.3 Mini size Module based on Intel® Core™ Ultra Processor Series 3

DATA SHEET

COM-HPC Mini Carrier Boards

COM-HPC Mini Base Preliminary

COM-HPC Mini Type Reference Carrier Board in ATX Form Factor

DATA SHEET

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娛樂資訊

智慧醫療

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機器人技術

半導體解決方案

智慧製造

AMD-based Solutions

Ampere-based Solutions

Arm-based Solutions

Intel-based Solutions

MediaTek-based Solutions

NVIDIA-based Solutions

NXP-based Solutions

Qualcomm-based Solutions

EdgeOpen™ Voices

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下載

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價值

公司

新聞

For Mission-Critical Edge and Physical AI

Intel Core Ultra Series 3 Processors with Integrated CPU, GPU and NPU

Advanced hybrid architecture for mixed-criticality workloads

Industrial durability and flexibility for the intelligent edge

Kick-start your project with I-Pi development kits

COM Express Type 6 Basic Modules

COM Express Type 6 Carrier Boards

COM-HPC Mini Modules

COM-HPC Mini Carrier Boards

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