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    模块化电脑
    • COM-HPC 计算模块
    • COM Express
    • OSM
    • SMARC 计算模块
    • Qseven 计算模块
    • ETX
    GPU解决方案
    • MXM GPU 模块
    • PCIe 显卡
    加固级计算
    • CompactPCI & CompactPCI Serial
    • VPX
    • PC104
    • AVA Railway Rugged Computers
    • PIDS
    边缘计算平台
    • 工业电脑/主板/单板电脑
    • 嵌入式电脑 / IoT Gateway
    • 边缘 AI 计算平台
    • AI 智能相机
    • 机器人控制器
    • 工业级固态硬盘(SSD)
    工业级显示系统与平板电脑
    • 纯平工业级触控显示器
    • 开放式架构平板电脑
    • All-in-One 多合一屏控电脑
    • 坚固型面板电脑
    • 数字标牌播放器
    汽车解决方案
    • 自动驾驶解决方案
    • AI-ADAS 解決方案
    网络与服务器
    • AI GPU 服务器
    • 工业与电信服务器
    • 网络安全平台
    自动化和控制
    • 机器视觉
    • 运动控制 I/O
    • EtherCAT 运动控制解決方案
    • HMI 屏控电脑
    • 数据采集卡
    • GPIB 与数字化仪
    • PXI 平台与模组
    • 自主移动机器人
    • 工业物联网网关
    设计与制造服务
    • DMS+(ODM/OEM 服务)
    医疗专用电脑和显示器
    • 医疗专用触控电脑
    • 医疗专用显示器
    • 医用 BOX PC
  • 行业
    车用解决方案 国防与军工 智能医疗 工业自动化 网络和通信 智能物流 半导体解决方案 智慧城市 测试测量 铁路 机器人技术

    车用解决方案

    车用解决方案

    凌华科技的自动驾驶运算平台採用尖端技术,致力提供更安全、更高效的驾驶运行。以强大的运算能力,满足自动驾驶和先进驾驶辅助系统(ADAS)技术,并提供适用于汽车的坚固设计。

    了解更多

    国防与军工

    Defence & Aviation

    在国防航空领域中,准确观察环境做出快速可靠的决策并及时采取行动至关重要。 凌华科技坚固的系统和Data Distribution Service(DDS)是大型数据基础架构的关键部分,该基础架构可收集、存储、分析信息并将信息从现场传递给决策者。

    了解更多

    智能医疗

    Healthcare

    凌华科技专注于医疗可视化设备和经过医疗认证的解决方案,从而满足智能医疗数字化的需求。 通过利用PENTA在医疗领域的设计和制造能力,凌华科技的智能医疗解决方案可加速各种医疗环境中的智能转型。

    了解更多

    工业自动化

    Industrial Automation

    工业自动化是全球制造业的重要方面。 凌华科技在系统、平台和产品的解决方案上提供了灵活的选择,从而克服了制造部署所面临的极端严苛环境问题,并在工厂车间提供了互联且无碍的性能。

    了解更多

    网络和通信

    概述
    5G & MEC 网络安全

    智能物流

    Retail Logistics

    在每天实时处理大量包裹时,要保持出色的客户服务和准时交付,同时减少零售库存和提高员工生产率可能非常困难。 凌华科技的解决方案使客户的包裹和托盘变得智能化,有效地连接整个供应链并改善仓库物流。

    了解更多

    半导体解决方案

    半导体解决方案

    你所能想象的一切,都因芯片而有所改变。为了满足不同场景应用的需求,完美的晶圆制造对于工艺要求以及效率和生产力的过程都无比讲究。

    了解更多

    智慧城市

    Smart City

    智慧城市泛指通过物联网收集各种数据,并利用从数据中获取的信息,对城市的资产、资源和服务等进行有效的管理与运用。 凌华科技的数据决策解决方案整合了图像分析,可靠的设计,提供稳定性和可靠性,是实现高效智慧城市的理想选择。

    了解更多

    测试测量

    Test & Measurement

    测试测量应用通过专用设备,用于分析、确认以及验证电子设备测量和最终产品。 凌华科技将继续通过创新产品扩展其测试测量产品,以满足高速和高带宽应用的特殊需求。

    了解更多

    铁路

    铁路

    我们的强固型CompactPCI,模块化电脑(COM),工业级系统和平板电脑等产品组合专为板载ATO / DMI和路旁CTC / RBC / TSR铁路解决方案应用设计。凌华科技在设计和制造方面的卓越的灵活性已被全球顶级铁路信号提供商所采用。

    了解更多

    机器人技术

    机器人技术

    自主移动机器人(AMR)无需或仅需极少的人工操作监督其执行任务。诸如学校、医院、大型购物中心和工厂之类的地方可以大量部署AMR以提高运营效率和生活品质。

    了解更多

    特色解决方案

    5G MEC

    自动驾驶

    GPU解决方案

    ROS2解决方案

    智能制造

  • 战略合作伙伴
    AMD Ampere Arm Intel MediaTek NVIDIA NXP Qualcomm

    AMD-based Solutions

    AMD-based Solutions by ADLINK

    Empower your edge computing with ADLINK, a leading company enabling edge solutions. Leverage AMD's high performance, secure integration, and power efficiency advantages for a wide range of edge, networking, and edge systems with x86 core architecture. Experience superior processing and graphics performance with ADLINK's utilization of AMD Ryzen™ Embedded series, powered by Radeon™ RX, perfect for industrial, medical, automation and gaming applications.

    Learn More

    Ampere-based Solutions

    Ampere-based Solutions by ADLINK

    Experience the future of edge computing with our comprehensive offering, which includes the Ampere Altra-based COM-HPC module, a developer platform and/or dev kit. Dive in now to unleash superior performance, energy efficiency, and optimized TCO in applications including but not limited to industrial automation, autonomous vehicles, transportation, healthcare, video surveillance, and energy management.

    Learn More

    Arm-based Solutions

    Arm-based Solutions by ADLINK

    Based on Arm architecture, ADLINK also collaborates with Ampere, NXP, MediaTek, Qualcomm, and Rockchip in module computing development and value-added solutions across varied industries, including smart manufacturing, autonomous driving, robotics, AMR, drone, transportation, logistics, retail, infotainment, healthcare, security, and more.

    With plug-and-play tools, development kits, and all-encompassing systems, ADLINK and Arm empowers developers to accelerate and realize their innovations.

    Learn More

    Intel-based Solutions

    Intel based Solutions by ADLINK

    ADLINK is a Titanium member in Intel® Partner Alliance. From modular computing to system-ready use cases, ADLINK works closely with Intel to provide scalable, interoperable solutions that accelerate your intelligent device deployment with end-to-end analytics.

    Utilizing Intel-based modules, ADLINK accelerates your products’ time to market with edge AI platform development support while addressing diverse industry pain points, such as in networking, smart manufacturing, autonomous driving, AMR, transportation, healthcare, retail, and infotainment.

    Learn More

    MediaTek-based Solutions

    MediaTek-based Solutions by ADLINK

    ADLINK Technology and MediaTek are strategic partners that deliver innovative and powerful solutions for edge computing and edge AI applications. Leveraging MediaTek's flagship, power-efficient Genio platform SoCs and ADLINK's expertise in embedded and rugged designs, they provide high-performance, energy-efficient, and reliable modules and platforms in accomplishing various IoT use cases, such as smart home, human-machine interface, multimedia, industrial IoT, and robotics.

    Learn More

    NVIDIA-based Solutions

    NVIDIA-based Solutions by ADLINK

    To fulfill industry-specific requirements, ADLINK is able to efficiently develop edge AI platforms, AI smart cameras, medical platforms, and AI portable GPU accelerators based on NVIDIA Jetson modules, the NVIDIA IGX platform, and RTX Embedded GPUs for applicable industries, including smart manufacturing, autonomous driving, autonomous mobile robots (AMR), robotics, transportation, healthcare, logistics, retail, infotainment, AI development, professional graphics, and gaming.

    Learn More

    NXP-based Solutions

    NXP-based Solutions by ADLINK

    Utilizing NXP's i.MX 8 and i.MX 9 series technology, ADLINK offers edge-connected solutions to assist medical, test & measurement, automation, and smart city customers reduce TCO. This combination of NXP's technology with ADLINK's R&D experience in edge computing provides versatile and dynamic solutions for critical applications.

    Learn More

    Qualcomm-based Solutions

    Qualcomm-based Solutions by ADLINK

    Qualcomm Technologies’ portfolio of leading robotics and drones solutions is driving next-generation use cases, including autonomous deliveries, mission critical use cases, commercial and enterprise drone applications and more.

    Among them, the Qualcomm QRB5165 solution is designed to help build consumer, enterprise or industrial robots with 5G connectivity, on-device AI and machine learning, superior computing, and intelligent sensing capabilities. By adopting Qualcomm QRB5165, ADLINK’s module will enable the proliferation of 5G in robotics and intelligent systems.

    Learn More
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    若您有任何价格、产品库存问题,或需要任何技术上的协助,欢迎随时与我们连系。

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    公司新闻、产品资讯、近期活动或技术部落格,一手掌握ADLINK的最新资讯。

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  • home
    • 产品
      模块化电脑+ GPU解决方案+ 加固级计算+ 边缘计算平台+ 工业级显示系统与平板电脑+ 汽车解决方案+ 网络与服务器+ 自动化和控制+ 设计与制造服务+ 医疗专用电脑和显示器+
      COM-HPC 计算模块COM ExpressOSMSMARC 计算模块Qseven 计算模块ETX
      MXM GPU 模块PCIe 显卡
      CompactPCI & CompactPCI SerialVPXPC104AVA Railway Rugged ComputersPIDS
      工业电脑/主板/单板电脑嵌入式电脑 / IoT Gateway边缘 AI 计算平台AI 智能相机机器人控制器工业级固态硬盘(SSD)
      纯平工业级触控显示器开放式架构平板电脑All-in-One 多合一屏控电脑坚固型面板电脑数字标牌播放器
      自动驾驶解决方案AI-ADAS 解決方案
      AI GPU 服务器工业与电信服务器网络安全平台
      机器视觉运动控制 I/OEtherCAT 运动控制解決方案HMI 屏控电脑数据采集卡GPIB 与数字化仪PXI 平台与模组自主移动机器人工业物联网网关
      DMS+(ODM/OEM 服务)
      医疗专用触控电脑医疗专用显示器医用 BOX PC
      AdvancedTCA 交换刀片AdvancedTCA 平台 AdvancedTCA 处理器刀片
      固态硬盘
      COM-HPC Server Type COM-HPC Client Type
      COM Express Type 6 COM Express Type 7 COM Express Type 10 COM Express Type 2
      MXM 3.1 Type A MXM 3.1 Type B
      Pocket AI (便携式GPU)
      3U VPX 处理器刀片 6U VPX 处理器刀片 VPX 显卡和 XMC 模块
      Mini-ITX 工业母板 可扩展的无风扇嵌入式电脑 高集成度无风扇嵌入式电脑 ATX 工业母板 嵌入式板卡 工业电脑系统 PICMG 单板电脑 无源背板 工业电脑外围卡 工业电脑机箱
      搭载NVIDIA Jetson系列
      ROS2 解决方案 ADLINK ROS2 Github NeuronSDK
      2U 网络安全平台 4U 网络安全平台
      图像采集卡/视频采集卡 图像分析软件 智能相机 视觉系统 人工智能机器视觉系统
      集中式运动控制器 分布式运动控制器 编码器和触发器 运动控制软件和工具
      机器设备状态监测解决方案 数据采集卡 (DAQ) 数字化仪
      PXI 机箱 PXI 控制器 PXI/cPCI 模块 远程控制器
      AMR
    • 行业
      车用解决方案 国防与军工 智能医疗 工业自动化 网络和通信 智能物流 半导体解决方案 智慧城市 测试测量 铁路 机器人技术

      车用解决方案

      车用解决方案

      凌华科技的自动驾驶运算平台採用尖端技术,致力提供更安全、更高效的驾驶运行。以强大的运算能力,满足自动驾驶和先进驾驶辅助系统(ADAS)技术,并提供适用于汽车的坚固设计。

      了解更多

      国防与军工

      Defence & Aviation

      在国防航空领域中,准确观察环境做出快速可靠的决策并及时采取行动至关重要。 凌华科技坚固的系统和Data Distribution Service(DDS)是大型数据基础架构的关键部分,该基础架构可收集、存储、分析信息并将信息从现场传递给决策者。

      了解更多

      智能医疗

      Healthcare

      凌华科技专注于医疗可视化设备和经过医疗认证的解决方案,从而满足智能医疗数字化的需求。 通过利用PENTA在医疗领域的设计和制造能力,凌华科技的智能医疗解决方案可加速各种医疗环境中的智能转型。

      了解更多

      工业自动化

      Industrial Automation

      工业自动化是全球制造业的重要方面。 凌华科技在系统、平台和产品的解决方案上提供了灵活的选择,从而克服了制造部署所面临的极端严苛环境问题,并在工厂车间提供了互联且无碍的性能。

      了解更多

      网络和通信

      概述
      5G & MEC 网络安全

      智能物流

      Retail Logistics

      在每天实时处理大量包裹时,要保持出色的客户服务和准时交付,同时减少零售库存和提高员工生产率可能非常困难。 凌华科技的解决方案使客户的包裹和托盘变得智能化,有效地连接整个供应链并改善仓库物流。

      了解更多

      半导体解决方案

      半导体解决方案

      你所能想象的一切,都因芯片而有所改变。为了满足不同场景应用的需求,完美的晶圆制造对于工艺要求以及效率和生产力的过程都无比讲究。

      了解更多

      智慧城市

      Smart City

      智慧城市泛指通过物联网收集各种数据,并利用从数据中获取的信息,对城市的资产、资源和服务等进行有效的管理与运用。 凌华科技的数据决策解决方案整合了图像分析,可靠的设计,提供稳定性和可靠性,是实现高效智慧城市的理想选择。

      了解更多

      测试测量

      Test & Measurement

      测试测量应用通过专用设备,用于分析、确认以及验证电子设备测量和最终产品。 凌华科技将继续通过创新产品扩展其测试测量产品,以满足高速和高带宽应用的特殊需求。

      了解更多

      铁路

      铁路

      我们的强固型CompactPCI,模块化电脑(COM),工业级系统和平板电脑等产品组合专为板载ATO / DMI和路旁CTC / RBC / TSR铁路解决方案应用设计。凌华科技在设计和制造方面的卓越的灵活性已被全球顶级铁路信号提供商所采用。

      了解更多

      机器人技术

      机器人技术

      自主移动机器人(AMR)无需或仅需极少的人工操作监督其执行任务。诸如学校、医院、大型购物中心和工厂之类的地方可以大量部署AMR以提高运营效率和生活品质。

      了解更多

      特色解决方案

      5G MEC

      自动驾驶

      GPU解决方案

      ROS2解决方案

      智能制造

    • 战略合作伙伴
      AMD Ampere Arm Intel MediaTek NVIDIA NXP Qualcomm

      AMD-based Solutions

      AMD-based Solutions by ADLINK

      Empower your edge computing with ADLINK, a leading company enabling edge solutions. Leverage AMD's high performance, secure integration, and power efficiency advantages for a wide range of edge, networking, and edge systems with x86 core architecture. Experience superior processing and graphics performance with ADLINK's utilization of AMD Ryzen™ Embedded series, powered by Radeon™ RX, perfect for industrial, medical, automation and gaming applications.

      Learn More

      Ampere-based Solutions

      Ampere-based Solutions by ADLINK

      Experience the future of edge computing with our comprehensive offering, which includes the Ampere Altra-based COM-HPC module, a developer platform and/or dev kit. Dive in now to unleash superior performance, energy efficiency, and optimized TCO in applications including but not limited to industrial automation, autonomous vehicles, transportation, healthcare, video surveillance, and energy management.

      Learn More

      Arm-based Solutions

      Arm-based Solutions by ADLINK

      Based on Arm architecture, ADLINK also collaborates with Ampere, NXP, MediaTek, Qualcomm, and Rockchip in module computing development and value-added solutions across varied industries, including smart manufacturing, autonomous driving, robotics, AMR, drone, transportation, logistics, retail, infotainment, healthcare, security, and more.

      With plug-and-play tools, development kits, and all-encompassing systems, ADLINK and Arm empowers developers to accelerate and realize their innovations.

      Learn More

      Intel-based Solutions

      Intel based Solutions by ADLINK

      ADLINK is a Titanium member in Intel® Partner Alliance. From modular computing to system-ready use cases, ADLINK works closely with Intel to provide scalable, interoperable solutions that accelerate your intelligent device deployment with end-to-end analytics.

      Utilizing Intel-based modules, ADLINK accelerates your products’ time to market with edge AI platform development support while addressing diverse industry pain points, such as in networking, smart manufacturing, autonomous driving, AMR, transportation, healthcare, retail, and infotainment.

      Learn More

      MediaTek-based Solutions

      MediaTek-based Solutions by ADLINK

      ADLINK Technology and MediaTek are strategic partners that deliver innovative and powerful solutions for edge computing and edge AI applications. Leveraging MediaTek's flagship, power-efficient Genio platform SoCs and ADLINK's expertise in embedded and rugged designs, they provide high-performance, energy-efficient, and reliable modules and platforms in accomplishing various IoT use cases, such as smart home, human-machine interface, multimedia, industrial IoT, and robotics.

      Learn More

      NVIDIA-based Solutions

      NVIDIA-based Solutions by ADLINK

      To fulfill industry-specific requirements, ADLINK is able to efficiently develop edge AI platforms, AI smart cameras, medical platforms, and AI portable GPU accelerators based on NVIDIA Jetson modules, the NVIDIA IGX platform, and RTX Embedded GPUs for applicable industries, including smart manufacturing, autonomous driving, autonomous mobile robots (AMR), robotics, transportation, healthcare, logistics, retail, infotainment, AI development, professional graphics, and gaming.

      Learn More

      NXP-based Solutions

      NXP-based Solutions by ADLINK

      Utilizing NXP's i.MX 8 and i.MX 9 series technology, ADLINK offers edge-connected solutions to assist medical, test & measurement, automation, and smart city customers reduce TCO. This combination of NXP's technology with ADLINK's R&D experience in edge computing provides versatile and dynamic solutions for critical applications.

      Learn More

      Qualcomm-based Solutions

      Qualcomm-based Solutions by ADLINK

      Qualcomm Technologies’ portfolio of leading robotics and drones solutions is driving next-generation use cases, including autonomous deliveries, mission critical use cases, commercial and enterprise drone applications and more.

      Among them, the Qualcomm QRB5165 solution is designed to help build consumer, enterprise or industrial robots with 5G connectivity, on-device AI and machine learning, superior computing, and intelligent sensing capabilities. By adopting Qualcomm QRB5165, ADLINK’s module will enable the proliferation of 5G in robotics and intelligent systems.

      Learn More
    • 支持

      支持

      合作伙伴中心eRMA服务ADLINK DDS支持

      下载专区

      软件与驱动程序ADLINK DDS下载PublicationsContent HubADLINK GitHub

      联系我们

      销售咨询中国区合作伙伴咨询技术专家全球经销商线上商城

      若您有任何价格、产品库存问题,或需要任何技术上的协助,欢迎随时与我们连系。

      了解更多
    • 关于我们

      价值

      品质政策与资源联盟企业永续环保和责任CapabilitesProduct Security

      公司

      关于凌华全球办事处投资者关系企业logo与品牌规范加入凌华

      新闻

      新闻和活动Podcast博客
      Support

      公司新闻、产品资讯、近期活动或技术部落格,一手掌握ADLINK的最新资讯。

      了解更多
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The Secret to Overcoming the Challenges of Intelligent Transportation Systems Design

By Jeff Munch,
CTO, ADLINK Technology

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According to Intel, there are currently one billion embedded intelligent systems in existence. As this statistic relates to the transportation industry, the worldwide market for intelligent transportation systems (ITS) devices is expected to increase at a 22.2% compound annual growth rate (CAGR) and reach a value of $65 billion in 2015 (Source: BCC Research's 2010 Intelligent Transportation Systems Review).

 

Intelligent transportation systems enable users to be better informed and make safer and smarter use of transport networks. They also allow transport providers to better track and manage their critical assets. However, designing an embedded solution with intelligence adds complexity to an already challenging development environment. Ruggedization, regulatory requirements and/or certification, size, and cost constraints mean that embedded ITS systems will by definition be a mix of all of these starting from an existing small form factor (SFF) such as COM, COM Express, EBX, or a variation.

ITS Design Requirements: Rugged, Small, Certified

 

Transportation solutions are most often housed outdoors or in moving vehicles, where exposure to a variety of climates dictates the need to operate in extended temperatures and to support the extremes of shock, vibration and humidity. In addition, space restrictions require putting expanding functionality on ever-smaller board form factors. Because of cost and the complex nature of intelligent embedded computing solutions for transportation, system qualification can take a very long time and require designers to look for products with a long lifecycle. Finally, transportation infrastructure is highly regulated around the world, so extra certification requirements are almost always part of a rugged ITS specification.

 

There is no panacea for the challenges that are inherent in the variety of rugged, horizontal applications for ITS, but rather there are optimal solutions that can provide the highest level of success based on the specific application requirements. We'll examine some systems and uncover the tradeoffs reached to achieve optimal results using COTS SFFs.

 

Locomotive DVR & Data Gateway

 

A leading global supplier of technology solutions for railroads wanted to develop an onboard locomotive video/audio capture system to aid in accident investigations and provide safety training to crews. In addition to video and audio recording, requirements for the system included remote monitoring and control, real-time health monitoring and wireless video download.

 

To address vibration issues with data storage, the system incorporated solid-state media in a sealed, tamper-resistant housing. General options for storage include rotating hard disk drives (HDDs) for economy or solid-state drives (SSDs), which are more rugged, but also come at a higher price point. HDDs contain spinning disks and movable read/write heads, whereas SSDs use microchips that retain data in non-volatile memory chips and contain no moving parts, making them less susceptible to physical shock, altitude, and vibration issues. SSDs have faster access time and lower latency than do HDDs, and the flash memory and circuit board materials of SSDs make them lighter than higher performing HDDs. With the weight and vibration resistant requirements of mobile applications, solid-state media is a better choice for most ITS solutions.

 

For the onboard locomotive video/audio capture system, designers created a rugged solution around the Intel embedded architecture and Embedded Board eXpandable (EBX) Single Board Computer (SBC) form factor. EBX is a good format options for designs that can handle a slightly larger (than, say, a computer-on-module) single-board computer (SBC) form factor. Still small with just 46 square inches of surface area (8" x 5.75"), EBX balances size and functionality with a bolt-down SBC format supporting rugged embedded designs with higher-performance CPUs such as those using multicore technology for networking, digital signal processing (DSP) and graphics-heavy applications, and generous on-board Input/Output (I/O) functions to support everything from large data exchange to video. The design accommodated both functionality and rugged requirements for the train system with dual Ethernet, CRT and flat panel video, multiple serial and USB ports, SATA and IDE interfaces, high-definition audio, and General Purpose Input/Output (GPIO) support.

 

A critical byproduct of on-site video/audio capture is reduced litigation and settlement costs due to accurate incident reporting. System reliability is critical to users in terms of return on investment, so designers used products that provided documented uptime in their specifications and met the Electromagnetic Interface/Compatibility (EMI/EMC) EN50155 industry standard.

Intelligent Bus Network

 

A leading designer of innovative technology solutions for all modes of public transportation implemented an on-board smart system enabling transit agencies to communicate with customers and dispatch, maintain its fleet and collect and analyze operating data (Figure 1).The numerous control inputs included vehicle run switch, front and rear door, wheelchair ramp, stop request, odometer and emergency alarm. The solution also required GPS with driving recorder and support for both wireless and cellular transmission. Finally, the company required a Class A device for testing against SAE International standards.

Figure 1: The hardware for the intelligent bus network solution was housed in a fixed space near the floor of each fleet vehicle, making the use of a rugged, small form factor design a must to compensate for space restrictions and potential shock, vibration and temperature extremes. (Image courtesy of U.S. Department of Transportation.)

Due to both space constraints within transit vehicles and the highly specialized application requirements, the COM Express form factor was selected for this particular embedded solution. Computer-on-modules (COMs) are complete embedded computers built on a single circuit board for use in small or specialized applications requiring low power consumption or small physical size. Though they are compact (ETX/XTX at 114 x 95 mm and COM Express at 125 x 95 mm to 84×55 mm) and highly integrated, COMs can accommodate complex CPUs.

 

With the COM approach, all generic PC functions are readily available in an off-the-shelf foundation module, allowing system developers to focus on their core competencies and the unique functions of their systems. A custom designed carrier board complements the COM with additional functionality that is required for specific applications. The carrier board provides all the interface connectors for peripherals, such as storage, Ethernet, keyboard/mouse and display. This modularity allows the designer to upgrade the COM on the carrier board without changing any other board design features, and also allows more customization of peripherals as dictated by a specific application (Figure 2).

Figure 2: A design using the COM Express form factor provides off-the-shelf functionality and an easy upgrade path by putting the customization on the baseboard, thereby creating more flexibility with the module without sacrificing performance.

The COM Express form factor offers flexibility in the development and advancement of ultra-rugged embedded transportation applications. By using the modular processing block, the designer creates a price and value advantage; he/she isn't locked into a single vendor for board creation and can customize based on pricing and performance requirements. Because it is easily swapped from a carrier board and comes in one of the smallest form factors, COM Express is ideal for long-life embedded applications with a critical development cycle, as well as more progressive applications that require frequent processor upgrades without affecting other application design elements.

 

The complete solution to create the intelligent bus network consisted of a rugged COM Express module plus custom baseboard with an Intel Atom processor. Mini PCI Express slots support 802.11 a/b/g/n and cellular modems for connectivity and specified operating and storage temperature, shock and operating and non-operating vibration requirements were all designed into and extensively tested to create the custom solution.

Train Operator Display

 

A leading provider of technology solutions in transportation, aerospace, defense and security was creating an in-vehicle operator display system that could be installed in rail networks across the globe. The purpose of the display system was to provide an interface for conductors to monitor and manage train activity. Because the display system was being designed for subway and rail systems in multiple countries, the solution needed to account for variation: multiple sizes for display installation areas; multiple power requirements; multiple certification requirements.

 

The end solution started with two customized panel sizes, 10" and 6.5", with Texas Instruments ARM-based processors (Figure 3).The "system on display" style rugged panels offered low power consumption, which allowed a slim, fanless design and the ability to fit into tighter spaces. Two power supplies were included to meet international standards (input voltage 24VDC/36VDC or 72VDC/110VDC), and the solution was built in accordance with transportation specifications from Cenelec, the European Committee for Electrotechnical Standardization, and Arema, the American Railway Engineering and Maintenance-of-Way Association.

 


Figure 3: The customized panel is a System on Display combining an LCD panel, CPU board and touch-screen in a compact package that can be used in both industrial and consumer-based applications, such as point-of-sale kiosks and digital advertising signage.

 

This display system was also designed to meet a stringent mean time between failure (MTBF) requirement of over 100,000 hours (~ 2x normal MTBF requirement). To accomplish this, the design had to be rugged, The initial step was to select a rugged board that was designed for harsh environments from the ground up. With rugged—as opposed to ruggedized—solutions that support the extremes of shock, vibration, humidity and temperature, care is given to component selection, circuit design, Printed Circuit Board (PCB) layout and materials, thermal solutions, enclosure design and manufacturing process.

 

Robust test methods ensure optimal product design phases in order to meet a product's stringent requirements, such as -40 °C to +85 °C operating temperature range, MIL-STD, shock and vibration and long-term reliability. In the end, the designers selected hardware certified to meet military standard MIL-HDBK-217F for temperature range and EN61373 Class 1B / Arema Class for shock and vibration, as well as EMI/EMC: EN 610000-6-4 / EN 61000-6-2 / EN50121.

 

Meeting the ITS Design Challenge

 

As exemplified in the previous ITS designs, consistent requirements included the need for extreme environmental standards, space restrictions and specialized certifications to meet both technical and regulatory standards. To overcome these challenges, developers utilized already proven rugged hardware to provide a solid foundation for their designs. In addition, a familiarity with the pros and cons of small form factor options helped them to create a baseboard design that could best accommodate size and performance requirements. And to ensure certification success and system longevity, designers created solutions around standards-based hardware and products that follow the roadmap of an established architecture.

 

© Extension Media, 2013. This is the author's version of the work. It is posted here by permission of Extension Media for your personal use. Not for redistribution. The definitive version was published in EECatalog.com, February 19, 2013, http://www.extensionmedia.com/"


Related ADLINK Links:

  • More about ADLINK More about ADLINK COM Products
Why Stackable Systems Work Well in Rugged Environments 返回列表 Intel intelligent system framework (ISF)
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