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About Computer-on-Modules

運算技術正以驚人的速度發展，迫使設備製造商想方設法跟上以保持競爭力。對於同時開發高階和入門級產品的公司來說，由於需要整合更廣泛的技術，這一挑戰甚至更大。需要以最小化開發工作和上市時間的方式滿足廣泛產品要求的製造商應考慮採用嵌入式電腦模組(COM) 策略。

COM 模組化設計方法使設備開發人員不必擔心複雜的電腦系統設計的許多方面，同時允許在載板上實現差異化。透過使用行業標準的商用現貨 (COTS) 產品，設備製造商可以利用許多優勢。

Types of Computer-on-Modules

設備製造商可以從多種 COM 標準中進行選擇，例如 COM-HPC（COM-HPC 服務器類型和 COM-HPC 客戶端類型）、COM Express（COM Express Type 6、COM Express Type 7、COM Express Type 10 和 COM Express Type 2)、SMARC、Qseven 和 ETX，以滿足他們對性能、成本、功耗、尺寸和 I/O 以及其他選項的要求。凌華科技是一家國際公司，以當地語言和時區的技術專長為全球客戶提供服務。分公司和設計中心分佈在亞洲、歐洲、北美，為客戶提供及時的服務。

Module

COM Express
Basic, compact and mini size modules

COM-HPC
Server and client type modules

Qseven
Qseven 2.0 and 2.1 compliant modules

SMARC
SMARC 2.0 and 2.1 compliant modules

ETX
ETX standard size modules

CPU

AMD Ryzen V2000 COM Express Type 6 Compact embedded Computer-on-Module

AMD Ryzen V2000
V2748 / V2546 / V2718 / V2516

COM-HPC Ampere Altra
Q32 / Q80

NXP i.MX 8M Plus SMARC embedded Computer-onModule

NXP i.MX 8M Plus
i.MX 8M Plus Quad

INTEL Elkhart Lake
x6000E / J6426 / J6413 / N6415 / N6211

Reference Carrier Boards

COM-HPC Server Base Preliminary

COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor

DATA SHEET

Express-BASE6

於 ATX 架構下裝載了 COM Express® Type 6 參考設計載板

DATA SHEET

Express-BASE7

COM Express® Type 7 Reference Carrier Board in ATX Form Factor

DATA SHEET

Express-BASE

COM Express^® Type 2 Reference Carrier Board in ATX Form Factor

DATA SHEET

miniBASE-10R

COM Express Type 10 參考設計載板

DATA SHEET

I-Pi SMARC Plus

SMARC 2.1 Reference Carrier Board with M.2 Extension

DATA SHEET

Q7-BASE

Qseven^® Reference Carrier Board

DATA SHEET

ETX-Proto

ETX^® Reference Carrier Board in ATX Form Factor

DATA SHEET

Starter Kits

COM Express Type 7 Starter Kit Plus

This Computer-on-Module Starter Kit gets you going with Carrier Board Design and Software Verification in no time

DATA SHEET

COM Express Type 6 Starter Kit Plus

COM Express Type 6 Development Kit

DATA SHEET

LEC-Starterkit 2.0

LEC-Starterkit with LEC-BASE 2.0 carrier, SD card and ATX power supply (without LEC module and cooling solution), optional LVDS display

DATA SHEET

COM Express Type 10 Starter Kit Plus

DATA SHEET

Q7-Starterkit

This Starterkit gets you going with Carrier Board Design and Software Verification in no time. To be used along with Q7-BT, Q7-BW, and Q7-AL

DATA SHEET

COM Express Type 2 Starter Kit

DATA SHEET

Starter Kit - ETX

This Computer-on-Module Starter Kit gets you going with Carrier Board Design and Software Verification in no time

DATA SHEET

Publication Download

Catalogue

[Catalog] 2023 Computer on Modules Catalog
Application Story

Application Story: Battlespace communications systems with COM Express Type 7 module
Technical Article

High-End Edge Computing Demands the Server-Level Compute Power of COM-HPC
Technical Article

ADLINK I-Pi Blends Raspberry Pi, COMs for Rapid Industrial Prototyping
Technical Article

Hexa-core COM Express modules deliver impressive performance for power-constrained applications
Technical Article

Lab Test Report of COM Express Type 7 Starter Kit with Module
Technical Article

COM Express Type 6 Module and Starter Kit Plus Review
Technical Article

Technical Article: Ideal Small Form Factor Choices Require Consideration of both Technical and Strategic Options
WhitePaper

SMARC 2.0 - New release of SGET specification for credit-card sized Computer-on-Modules

Product Catalog

Computer-on-Modules Catalog 2021

ADLINK’s computer-on-module products (COM-HPC, COM Express, SMARC, ETX, Qseven) are not only leading edge when it comes to quality and standardization, they're packed with design innovations and backed up by top-class production and manufacturing logistics that ensure timely delivery.

Download

Solution Brief

High-End Edge Computing Demands the Server-Level Compute Power of COM-HPC

Download the solution brief to learn how ADLINK COM-HPC modules can help system designers to meet their requirements for increasing computational power and performances needs and future-proof their designs.

Download

Solution Brief

ADLINK I-Pi Blends Raspberry Pi, Computer-on-Modules for Rapid Industrial Prototyping

Cost and time-to-market are the name of the game in the electronics industry. Download the solution brief to learn how ADLINK I-Pi SMARC devkit can help engineers to meet aggressive timelines and stay within budget.

Download

Application Story

Battlespace communications systems with COM Express Type 7 module

The Battlespace Communications System is used for the wired and wireless infrastructure of army divisions and command centers. Download this application story to learn how a Battlespace Communications System with COM Express Type 7 module can be applied in defense solutions.

Download

AMD Ryzen V2000 COM Express Type 6 Module

INTEL Elkhart Lake COM Express Type 10 Module

NXP i.MX 8M Plus SMARC AI-on-Module

TEL:(02) 8226-5877 TEL:(02) 8226-5877 FAX:(02) 8226-5729 Email:tw@adlinktech.com Address:新北市中和區建一路166號9樓

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網路和通訊

電力與能源

智慧物流

半導體解決方案

智慧城市

量測

智慧交通

機器人技術

焦點方案

5G MEC

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GPU 解決方案

ROS 2 解決方案

智慧製造

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新聞

6U CompactPCI 2.0 主機板

cPCI-6636(KL) Series

COM Express Type 10

nanoX-EL

3U CompactPCI Serial 主機板

cPCI-A3525

6U CompactPCI 2.0 主機板

cPCI-6636(KL) Series

COM-HPC Server Module

COM-HPC-ALT

AdvancedTCA 交換器

aTCA-3430

ATX 主機板

IMB-M47H

嵌入式固態硬碟

2.5 inch SATA SSD Series

DDS

ADLINK DDS

ADLINK Edge SDK

Edge SDK

醫療平板電腦和顯示器

MLC-AL/ MLC-KL

COM Express Type 6 模組化電腦

Express-RLP

Preliminary

Mini-ITX 嵌入式主機板

AmITX-SL-G

Edge 伺服器

MECS-6110

設備狀態監測與維護平台

MCM-204

嵌入式 MXM 模組

EGX-MXM-T1000

嵌入式 MXM 模組

EGX-MXM-T1000

可擴充式無風扇電腦

MVP-6100

機器視覺

PCIe-U300 Series

COM-HPC Server Module

COM-HPC-ALT

Edge 伺服器

MECS-6110

深度學習推論平台

DLAP-301-JNX

Preliminary

Autonomous Mobile Robot

SMR250 series

Preliminary

Industrial Touch Monitors

IM Series

Edge 伺服器

PCIe-ACC100

COM-HPC Client Module

COM-HPC-cRLS

Preliminary