About COM-HPC Mini Type Modules
The COM-HPC specification add mini type at dimension of 95mm x 70mm in Rev 1.2. It addresses a need seen for a smaller form factor, lower power envelope and lower cost at single 400-pin connector. A single power rail input with 8 to 20-volt range deliver up to 107 watts of power and there are 16x lanes PCIe Gen5 in total.
The COM-HPC Mini type modules deliver robust computing power that rivals full-sized counterparts. They are engineered for efficiency, with advanced ruggedness, thermal management and energy-saving features. Like COM-HPC Server and Client type, COM-HPC Mini supports high-bandwidth interfaces including USB 4.0, Thunderbolt, 16 PCIe Gen 5 lanes, and 10 Gbit/s Ethernet. However, the reduced pin count necessitates pin sharing for some functions. At the same time, the Mini form factor adds some interfaces that are common in small form factor applications, such as a CAN bus, SGMII ports. The Mini also adjusts many I/O voltage rails from 3.3V to 1.8V for lower power consumption and increased efficiency. The use of soldered memory ensures ruggedness, accommodating the form factor’s smaller size and reduced stack height.
These modules are the perfect solution for space-constrained applications, offering the latest in high-speed interfaces and multi-core processing capabilities. The range of applications for COM-HPC Mini type modules is very broad: medical equipment, test & measurement, compact rugged embedded servers, transportation systems and more.
