[ 2016/10/25 ]
San Jose, CA – October 25, 2016 – ADLINK Technology, Inc., a leading global provider of embedded building blocks and application-ready intelligent platforms that enable the Internet of Things (IoT), today announced new computer-on-modules and embedded boards based on the latest Intel® Pentium® N4200 and Intel® Celeron® N3350 processors (codename Apollo Lake) and Intel® Atom™ processor E3900 series (codename Apollo Lake-I). These new offerings take advantage of several improvements over the previous generation of respective Intel® processors, including improved graphics performance with support for Gen 9 LP (18x EUs) and 4K/UHD displays, added virtualization capabilities with full support for Intel® VT-x/VT-d, high-speed DDR3L memory and eMMC 5.0 flash storage.
ADLINK has developed two new COM Express® modules, the Compact Size cExpress-AL and Mini Size nanoX-AL. Both modules offer DDR3L memory up to 1867MHz, with the nanoX-AL supporting a soldered memory capacity range from 2GB to 8GB. In addition to providing three independent display ports that cover DDI/LVDS/optional analog VGA, the cExpress-AL fully utilizes the graphics capabilities enabled through the latest Intel® Atom™ processor and still supports legacy applications. Both modules are cost efficient platforms with rich native I/O support that eliminate the need for an added USB hub, and provide long-life support of at least seven years.
ADLINK’s LEC-AL module is based on this year’s SMARC 2.0 specification update and offers dual-channel LVDS, 2x MIPI CSI camera interfaces and DDR3L memory up to 1867MHz. The company is also introducing the Q7-AL module based on the Qseven 2.1 specification with fast LPDDR4 memory. All new modules and boards target industrial automation, medical and infotainment applications that require compact, rugged forms factors for harsh, space constrained environments.
Finally, ADLINK’s thin Mini-ITX embedded board AmITX-AL-I offers a low profile design, dual DDR3L memory up to 1867MHz, and dual BIOS and Trusted Platform Module (TPM) support. Rich graphics interfaces and I/O includes HDMI, 2x DisplayPort, LVDS/eDP (optional), 7x USB, 6x COM port, dual GbE LAN, PCIe x1, mini-PCIe, 2x SATA 3 and mSATA.
“This latest generation of the Intel® Pentium®, Intel® Celeron® and Intel® Atom™ processors offers several new high-end features that help to lower the overall expense of customer applications requiring high performance computing,” said Dirk Finstel, executive vice president of ADLINK’s Module Computing Product Segment. “These features include support for up to three independent 4K/UHD displays at 4096x2160@60Hz and added virtualization capabilities, as well as H.265 compression for Internet streaming, which saves bandwidth and lowers communication costs.”
All new modules and boards are equipped with ADLINK’s Smart Embedded Management Agent (SEMA) to provide access to detailed system activities at the device level, including temperature, voltage, power consumption and other key information, and allow operators to identify inefficiencies and malfunctions in real-time, thus preventing failures and minimizing downtime. ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are accessible any place, at any time via encrypted data connection.
For more information on our new computer-on-module and embedded board offerings based on the latest Intel® Pentium® N4200 and Intel® Celeron® N3350 processors, as well as Intel® Atom™ processor E3900 series, please visit www.adlinktech.com.