ADLINK Launches Express-IBR with 3rd Generation Intel(R) Core(TM) Processors with Support for SuperSpeed USB 3.0 and PCI Express Gen 3

ADLINK Launches Express-IBR with 3rd Generation Intel® Core™ Processors with Support for SuperSpeed USB 3.0 and PCI Express Gen 3

Latest COM Express® Type 6 Module is based on the proven Express-HRR design, but with a 25 percent increase in CPU performance and 50 percent increase in graphics performance

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ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the release of its latest Ampro by ADLINK™ Extreme Rugged™ COM Express® module, the Express-IBR for airborne and vehicle-mounted military computers and human machine interfaces (HMI) applications required to function in harsh environments. The Ampro by ADLINK™ Express-IBR is a COM Express Type 6 module that supports the quad-core and dual-core 3rd generation Intel® Core™ i7 processors and Mobile Intel® QM77 Express chipset. Following ADLINK's Rugged By Design methodology, the Express-IBR is ideal for use in environments prone to severe shock, vibration, humidity, and extended temperature ranges.

"ADLINK's Express-IBR is equipped with the 3rd generation Intel® Core™ processor, which utilizes Intel's new 3D tri-gate transistor technology and 22nm process technology," said Jeff Munch, CTO of ADLINK Technology and chair of the COM Express COM.0 R2.1 Sub-committee. "This platform delivers higher performance per watt over previous-generation processors - a feature that is critical for rugged applications requiring high performance in high temperature environments."

"The 3rd generation Intel® Core™ processor-based platform delivers best-in-class performance and reliability for ruggedized applications," said Matt Langman, director of marketing, Intel Intelligent Systems Group. "The new platform offers continued support for ECC on select processor SKUs to ensure data integrity, and the introduction of next generation I/O—such as integrated PCI Express Gen 3.0 and USB 3.0—enables processing of a significant amount of data over the 2nd generation Intel® Core™ processor family at lower or same thermal footprint."

The Ampro by ADLINK Express-IBR is powered by a quad- or dual-core 3rd generation Intel® Core™ processor and provides support for USB SuperSpeed 3.0, PCI Express (PCIe) Gen 3, and up to three independent displays. The COM Express module offers up to 16GB ECC 1333MHz DDR3 memory in two SODIMM sockets; three Digital Display Interfaces can be independently configured for DisplayPort, HDMI or DVI; PCIe x16 (Gen3) for external graphics or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4); as well as two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, and eight USB 2.0 interfaces. The Express-IBR with dual-core processor is validated for reliable performance in extended temperatures ranging from 40°C to +85°C and features a 50% thicker printed circuit board (PCB) for high vibration tolerance.

The Ampro by ADLINK Express-IBR is a modular, power efficient solution for applications running in space constrained, extreme rugged environments. The Express-IBR is compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout, which is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display Interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 6 pinout also supports SuperSpeed USB 3.0 interface, which was unavailable in COM.0 Rev. 1.0.

ADLINK Technology's Extreme Rugged modules, boards, and systems are designed for harsh environments from the ground up. Robust test methods, including Highly Accelerated Life Testing (HALT), ensure optimal product design phases and meet stringent requirements, such as extended temperature range, MIL-STD, shock and vibration, and long-term reliability.

 Learn more Ampro by ADLINK Extreme Rugged COM Express Products


ADLINK Technology is enabling the Internet ofThings (IoT) with innovative embedded computing solutions for edge devices,intelligent gateways and cloud services. ADLINK's products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products, smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended operating temperature ranges, and MIL-STD levels of shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including the PCI Industrial Computer Manufacturers Group (PICMG), the PXI Systems Alliance (PXISA), and the Standardization Group for Embedded Technologies (SGET).

ADLINK is a global company with headquarters in Taiwan; manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

For more information, please contact our worldwide offices nearest your region.
ADLINK Technology, Inc., Headquarters

9F., No.166, Jian 1st Rd., Zhonghe Dist., New Taipei City, Taiwan 235
Tel: +886-2-82265877
Fax: +886-2-82265717

Ampro ADLINK Technology, Inc.
5215 Hellyer Avenue, #110, San Jose, CA 95138, U.S.A.
Toll Free: +1-800-966-5200
Fax: +1-408-360-0222

LiPPERT ADLINK Technology, GmbH
Hans-Thoma-Str. 11, 68163 Mannheim, Germany
Toll Free: +1-800-966-5200
Tel: +49-621-432140
Fax: +49-621-4321430

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