ADLINK Adopts Latest Intel® Xeon® Scalable Processors for Open Compute Project-AcceptedTM OpenSled Offering

ADLINK Adopts Latest Intel® Xeon® Scalable Processors for Open Compute Project-AcceptedTM OpenSled Offering

Advanced computing capability and high bandwidth capacity in Intel’s new high - performance platform brings flexibility to 5G high-speed networks

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[ 2017/07/19 ]

San Jose, CA – July 19, 2017 – ADLINK Technology, a global provider of leading edge computing solutions that drive data-to-decision applications across industries, has announced a new data center compute node based on the latest Intel® Xeon® Scalable Processors . This new board, referenced as MCN-2610, will be the company’s first product based on the OCP- AcceptedTM OpenSled specification. The offering will help advance next generation architectures in support of Network Functions Virtualization (NFV), Software-Defined Networking (SDN), and Mobile Edge Computing (MEC) applications. The OpenSled specification is based on ADLINK’s Open Compute Carrier-grade Edge Reference Architecture (OCCERA) and was approved as a standard specification by Open Compute Project in April.

Hardware acceleration is the latest high-value feature in the move toward Edge, Cloud and Fog computing. Upcoming 5G solutions will require very low latency, support of many cores and be utilized for cross-network cloud infrastructure. The Intel® Xeon® Scalable Processor offers up to 28 cores, and supports 48 PCI Express 3.0 lanes and 4x10GbE lanes to address the challenges in next-generation networking, which combines security, NFV, and wireless communications on a common platform.

“Technologies such as Edge Computing and 5G will provide a faster data delivery to customers requiring high-speed memory, high-bandwidth and high expansion capabilities for high-speed devices in the competitive world of 5G.” said Yong Luo, General Manager of ADLINK’s Networking, Communication and Public Business Unit. “We are pleased to add this server platform to our highly flexible OCCERA product family. This high-performance platform will help our customers to utilize the latest data center and Edge compute technologies in order to differentiate their solutions and utilize the best platform for their applications.”

ADLINK’s first OpenSled sample is targeted for release in early Q3.

To download ADLINK’s OCP OpenSled specification, please click here.

For more information on ADLINK’s Open Compute Carrier-grade Edge Reference Architecture (OCCERA), please visit www.adlinktech.com/OCCERA.



About ADLINK

ADLINK Technology is leading edge computing with solutions that drive data-to-decision applications across industries. ADLINK offers a variety of building blocks and both generic and domain-specific Industrial Internet of Things (IIoT) platforms to serve the automation, communications, medical, transportation, and defense/government markets. Our products include motherboards, blades, chassis, modules, gateways, systems, and end-to-end solutions based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays, and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended temperature ranges, shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations and interoperability initiatives, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), Standardization Group for Embedded Technologies (SGeT), European Telecommunications Standards Institute (ETSI), and Open Compute Project (OCP).

ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan and China; an extensive network of worldwide sales and support offices; and a continually expanding partner ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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