New PICMG COM Express Plug-and-Play Subcommittee Formed

New PICMG COM Express Plug-and-Play Subcommittee Formed


ADLINK CTO Named as Interim Chair; Subcommittee to Draft New Plug-and-Play Carrier Board Specification

ADLINK Technology Inc., congatec AG, and MSC, have joined together to form a new PICMG COM Express plug and play subcommittee. The to-be-released COM Express Plug and Play Design Guide aims to increase the use of COM Express modules by defining a set of carrier design guidelines that enable plug-and-play support and increase compatibility between COM Express modules from various vendors. Jeff Munch, CTO of ADLINK Technology and Interim Chairman of the new subcommittee, expects this new PICMG carrier board design specification to release in February 2008.

After the release of the PICMG COM Express specification (COM.0), several manufacturers have filled the marketplace with a wide variety of COM Express modules. It soon became apparent that a plug-and-play specification was required to mitigate carrier board incompatibilities. Therefore, ADLINK, congatec AG, and MSC applied to the PICMG group for the creation of a subcommittee to define a COM Express Plug and Play Design Guide to increase adoption of the COM.0 standard through a plug-and-play carrier board design specification.

The basis of this subcommittee began in April 2007 when AAEON, ADLINK, Ampro, and congatec AG started the COM Express PnP Initiative which focused on carrier board design. Now this initiative has further evolved to address the incompatibilities seen between different vendors using proprietary carrier board designs by providing a definite specification to increase and streamline the adoption and use of COM Express products.

ADLINK COM Express


About ADLINK

ADLINK Technology is enabling the Internet ofThings (IoT) with innovative embedded computing solutions for edge devices,intelligent gateways and cloud services. ADLINK's products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products, smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended operating temperature ranges, and MIL-STD levels of shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including the PCI Industrial Computer Manufacturers Group (PICMG), the PXI Systems Alliance (PXISA), and the Standardization Group for Embedded Technologies (SGET).

ADLINK is a global company with headquarters in Taiwan; manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

For more information, please contact our worldwide offices nearest your region.
ADLINK Technology, Inc., Headquarters

9F., No.166, Jian 1st Rd., Zhonghe Dist., New Taipei City, Taiwan 235
Tel: +886-2-82265877
Fax: +886-2-82265717
http://www.adlinktech.com
Email: service@adlinktech.com

Ampro ADLINK Technology, Inc.
5215 Hellyer Avenue, #110, San Jose, CA 95138, U.S.A.
Toll Free: +1-800-966-5200
Fax: +1-408-360-0222
Email: info@adlinktech.com

LiPPERT ADLINK Technology, GmbH
Hans-Thoma-Str. 11, 68163 Mannheim, Germany
Toll Free: +1-800-966-5200
Tel: +49-621-432140
Fax: +49-621-4321430
Email: emea@adlinktech.com


Back NewsPast Product News: 2001-2013

   Contact Us | Career | Investor Relations | Partner Center | Sitemap |
Copyright © ADLINK Technology Inc., Specification and product names are trademarks or trade names of their respective companies or organizations.