ADLINK Open Compute Project Specification Approved for Carrier Grade CG-OpenRack-19

ADLINK Open Compute Project Specification Approved for Carrier Grade CG-OpenRack-19

OCP approves Open Sled Zone specification based on ADLINK’s Open Compute Carrier-grade Edge Reference Architecture and Plan of Intent through 2020

OpenRack-19

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[ 2017/04/26 ]

San Jose, CA(PRWEB) – April 26, 2017 – ADLINK Technology, Inc., a global provider of leading edge computing solutions that drive data-to-decision applications across industries, has successfully introduced its OpenSled specification, contributing to the evolution of the next generation of appliances that fit into the Open Compute Project (OCP) CG-OpenRack-19 specification.

Standards development around networking and communications frameworks has become increasingly important with the growing utilization of edge, cloud and fog computing architectures that support the OT/IT/CT convergence critical to driving business value. OCP’s CG-OpenRack-19 specification is used as a guideline for OCP suppliers and carriers to implement a standards-based computer system within central office environments utilizing an OCP-based infrastructure. This latest OCP- approved OpenSled spec is based on ADLINK’s OCCERA(Open Compute Carrier-grade Edge Reference Architecture), which provides the definitions for the internal configuration options of the CG OpenRack Sled, including options for key appliances to utilize additional components inside the sled. These options could include, but are not limited to, multi-host controllers, PCIe switching, software and hardware accelerators and storage solutions.

ADLINK’s OCP OpenSled specification enhances the OCP-AcceptedTM CG-OpenRack-19 specification submitted by Radisys in December 2016. Radisys laid the foundation for defining the frame, power, interconnect and sled dimensions. ADLINK’s OCP OpenSled specification provides:

  • A common architecture for OCP CG-OpenRack-19 allowing suppliers to build a standard central office product.
  • A one-half width sled for a multitude of options and high component density, with a full width spec to be defined later in 2017.
  • Zone definitions to give operators confidence that the sled is an open standard, while also providing many options for sled use cases.
  • An optional removable or hinged front panel for internal board replacement.
  • A mezzanine zone for Network Interface Modules (NIMs), switching, hardware acceleration, and PCIe expansion slots for off the shelf components.
  • Zones for server, memory, storage, etc.
  • Ability to add multi-host controllers, MR-IOV functionality, switching and hardware acceleration for additional capabilities.

“ADLINK’s their business strategy, aligns perfectly with the mission of the Open Compute Project to extend our open hardware collaboration to our carrier and communications service provider members,” said Bill Carter, Chief Technology Officer at the OCP Foundation. “We were excited when ADLINK began working with OCP’s Telco project community last year to author and validate the OpenSled specification that builds upon the CG-OpenRack-19 mechanical, power, and interconnect specification contributed by Radisys in 2016. This week, the foundation’s incubation committee formally accepts that work effort. Both Radisys and ADLINK, working with many service providers around the globe, have defined and contributed an open rack architecture that shares the efficiency, openness, and scale of our OpenRack specification, with adjustments for central office environments. The shared effort by ADLINK is a testament to how open collaboration is enabling the transformation of the telecom market.”

ADLINK’s focus on edge computing is a natural evolution from embedded systems to connected embedded computing that facilitates data acquisition and analysis to improve business operations. ADLINK is actively involved in several networking and communications standards organizations, including OpenFog Consortium, Network Intelligence (NI) Alliance, European Telecommunications Standards Institute (ETSI) for NFV and MEC, OpenNFV, OpenEdge Computing, Telecom Infra Project, Edge Computing Consortium and Central Office Re-architected as a Datacenter (CORD). In addition, ADLINK is a part of the Wind River Titanium Cloud Partner Ecosystem, a program dedicated to accelerating the deployment of solutions for NFV, and provides Wind River’s Titanium Server software as an integrated solution on ADLINK’s OCCERA(Open Compute Carrier-grade Edge Reference Architecture) and SETO-1000 extreme outdoor server; the integrated solution targets NFV/ software defined networks (SDN), MEC and IIoT deployments.

“Over the past several years, ADLINK has moved toward developing networking and communications platforms that enable the current requirements for edge and cloud computing architectures for telecom operators and data centers,” said Yong Luo, General Manager of ADLINK’s Networking, Communication and Public Business Unit. “We are very excited to work with OCP to drive innovation, customization and choices that enhance and simplify networking and communications infrastructure.”

Founded in 2011, the OCP is a collaborative community geared toward reimagining the design of server, storage, networking and other data center hardware with the goal of driving scalable computing through sharing of information and technical specifications. ADLINK has been a Gold Member since May 2016.

To download ADLINK’s OCP OpenSled specification, please visit the OCP website at www.opencompute.org/wiki/Telcos#Approved.

For more information on ADLINK’s OCCERA, please visit www.adlinktech.com/OCCERA/.



About ADLINK

ADLINK Technology is leading edge computing with solutions that drive data-to-decision applications across industries. ADLINK offers a variety of building blocks and both generic and domain-specific Industrial Internet of Things (IIoT) platforms to serve the automation, communications, medical, transportation, and defense/government markets. Our products include motherboards, blades, chassis, modules, gateways, systems, and end-to-end solutions based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays, and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended temperature ranges, shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations and interoperability initiatives, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), Standardization Group for Embedded Technologies (SGeT), European Telecommunications Standards Institute (ETSI), and Open Compute Project (OCP).

ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan and China; an extensive network of worldwide sales and support offices; and a continually expanding partner ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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