ADLINK Home > Trade Show Schedule > 2008 Embedded System Expo in Japan
Computer-on-Modules Express-MLC CompactPCI® cpci-3920

Express-MLC

COM Express™ module with Intel® Atom™ and SCH US15W

cPCI-3920

3U CompactPCI® Intel® Core™2 Duo Processor with 3100 Chipset SBC

Industrial SBC NuPRO-935A Embedded Controller DPAC

NuPRO-935A

PICMG® 1.0 Full-Size LGA775 Intel® Core™2 Quad/Duo SHB with DDR II, Dual-GbE, SATA II, IDE, FDD

DPAC-3000

Distributed PAC( Programmable Automation Controller ) with HSL( High Speed Link ) and Motionnet Bus

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We welcome you to learn about our various products and the many applications from ADLINK Technology at ESEC Japan. Visit us at Booth East 30-002 (Click here to get Booth Map) to speak with an ADLINK representative.

See you at ESEC this year!

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