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Ampro by ADLINK™ Computer-on-Modules

Ampro by ADLINK™ products include the most rugged computer-on-module (COM) offerings in the industry, featuring the most popular form factors and designed to provide fast time-to-market. Our ETX® modules are available for Extreme Rugged. applications, with an array of different features all the while providing the ability to upgrade ETX® baseboards without a complete redesign. Based on the PICMG® COM Express™ specifi cation, ADLINK's COM Express™ modules feature the latest technology such as Intel's Core™2 Duo and GME965/ICH8 chipset. This chip combination provides an Extreme Rugged. version uniquely suited for applications in harsh environments.

 Ampro Extreme Rugged Products

COM Express
COM Express™ offers the modular architecture for the latest and next generation technologies, giving OEMs the flexibility to optimally design systems based on current and future applications. It is suited for high-end graphics applications, military computers, high speed communications and other applications. ADLINK offers the COM Express™ form factor in an Extreme Rugged. version with Type II pinout.

ETX®
Ampro by ADLINK™ ETX® products are designed for Extreme Rugged. applications. Our ETX® COMs are for applications that use an ETX® footprint enabling short time-to-market and with future upgradeability. The Extreme Rugged. Ampro by ADLINK™ modules are designed specifi cally for harsh environments and are placed through a series of tests including the Highly Accelerated Life Test (HALT) and MIL-STD-202F shock and vibration methodologies.