Ampro by ADLINK™ products include the most rugged computer-on-module (COM) offerings in the industry, featuring the most popular form factors and designed to provide fast time-to-market. Our ETX® modules are available for Extreme Rugged. applications, with an array of different features all the while providing the ability to upgrade ETX® baseboards without a complete redesign. Based on the PICMG® COM Express™ specification, ADLINK's COM Express™ modules feature the latest technology such as Intel's Core™2 Duo and GME965/ICH8 chipset. This chip combination provides an Extreme Rugged. version uniquely suited for applications in harsh environments. ( more)