Features
- Intel® Core™2 Duo processor (up to 2.2 GHz)
- Intel® GME965 / ICH8M Chipset
- Dual SODIMM for up to 4 GB DDR2 at 800MHz
- Five PCIe x1, one PCIe x16 graphic (or x8)
- Dual-channel 24-bit LVDS, TV-out
- SATA-300, PATA, Gigabit LAN, USB 2.0
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Introduction
The Express-MC800 combines a Core 2 Duo CPU with Intel's Mobile GME965 Express Chipset. The chipset supports up to 4 GB, dual channel DDR2 667MHz memory on two stacked SODIMM sockets and integrates a Mobile Intel® Graphics Media Accelerator X3100 that provides CRT, single/dual channel 24-bit LVDS and TV-out (SDTV and HDTV). In addition to the onboard integrated graphics, a PCI Express x16 slot is available for connection to high end PCI Express x16 Graphics chipsets or general purpose x8, x4 or x1 PCI Express devices. The PCI Express Graphics (PEG) x16 bus can alternatively be used in SDVO mode to connect to DVI, TMDS or TV-out device controllers. The board allows connection of up to five additional PCI Express x1 devices on the ICH8M Southbridge.
The module comes with a single onboard Gigabit Ethernet port and three SATA 300 ports. It has legacy support for a single Parallel ATA channel, 32-bit PCI and LPC.
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Ordering Information | Express-MC800-S | COM Express™ Module with socket for Celeron® M or Core™2 Duo processor (for Intel® Core™2 Duo T7500 processor at 2.2 GHz or Intel® Celeron® M 550 processor at 2.0 GHz) | | Express-MC800-L7500 | COM Express™ Module with LV Intel® Core™2 Duo L7500 processor at 1.6 GHz | | Express-MC800-U7500 | COM Express™ Module with ULV Intel® Core™2 Duo U7500 processor at 1.06 GHz | | HTS-MC800-B | Heatspreader for Express-MC800 (BGA CPU) with threaded standoffs | | THS-MC800-B | Low Profile Heatsink for Express-MC800 (BGA CPU) with threaded standoffs | | THSH-MC800-B | High Heatsink for Express-MC800 (BGA CPU) with threaded standoffs | | THSF-MC800-S | High Performance Heatsink with Fan for Express-MC800 (socket CPU) with threaded standoffs |
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