Express-BD7 - Computer-on-Modules - COM Express Type 7 - Basic - ADLINK Technology
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ADLINK-Express-BD7-Computer-on-Modules-COM Express Type 7 - Basic

Preliminary


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Express-BD7

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COM Express Basic Size Type 7 Module with Up to 16 cores Intel® Xeon D and Pentium® D SoC (formerly codename: Broadwell-DE)

Features
  • Up to 16 cores Intel® Xeon D Series SoC (formerly codename: Broadwell-DE)
  • Up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC (dependent on SoC SKU)
  • Two 10G Ethernet and NC-SI support
  • Up to eight PCIe x1 (Gen2), one PCIe x16 (Gen3)
  • GbE, two SATA 6 Gb/s, four USB 3.0/2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option)
      |  Datasheet |  Other Document |     

  Introduction  
  Pinout Preview  
  Ordering Information  
Innovations of COM Express Type 7
- Supports up to 16-core server grade processors (Intel® Xeon® Processor D Family SoC)
- Brings 10GbE to COM Express
- Enables 1U servers with up to 10 modules

ADLINK's First COM Express Type 7 Module: Express-BD7
- 32GB dual channel DDR4 at 2400MHz with ECC
- 2x 10GbE with NC-SI support
- TDP below 65W, supports Intel® TXT
- 2x SATA 6 Gb/s, 4x USB 3.0, 8x PCIe x1 (Gen2), 1x PCIe x16 (Gen3)
- Supports Smart Embedded Management Agent (SEMA®)
- Extreme Rugged operating temp.: -40°C to +85°C (by build option)

The ADLINK Express-BD7 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BD7 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
"The information in this document provides a preview of the upcoming PICMG® COM.0 COM Express® Type 7 pinout. The pinout will officially launch with R3.0 of the specification later in 2016. The goal of this document is to provide COM Express module and carrier designers with information on the soon to be released Type 7 pinout so that potential users have the necessary design information." quoted from "PICMG® COM.0 COM Express™ Type 7 Preview"


Video DEMO

Innovation of COM Express Type 7


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