Express-BD7 - Computer-on-Modules - COM Express Type 7 - Basic - ADLINK Technology
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ADLINK-Express-BD7-Computer-on-Modules-COM Express Type 7 - Basic

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COM Express Basic Size Type 7 Module with Up to 16 cores Intel® Xeon D and Pentium® D SoC (formerly codename: Broadwell-DE)

  • Up to 16 cores Intel® Xeon D Series SoC (formerly codename: Broadwell-DE)
  • 32 GB Dual Channel DDR4 at 2133/2400 MHz
  • 2 x 10GbE+ GbE and NC-SI
  • Up to 32 PCIe lanes
  • GbE, 2xSATA 6 Gb/s, 4x USB 3.0/2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option)
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The Express-BD7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel® Xeon® processor D and Intel® Pentium® D processor system-on-chip (SoC) ( formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.

The Express-BD7 features Intel® Virtualization Technology (including VT-x, VT-d, EPT), Intel® Hyper-Threading Technology (up to 16 cores, 32 threads), Intel® Trusted Execution Technology, Intel® AES-NI Technology, and DDR4 ECC (or non-ECC) dual-channel memory at 1866/2133/2400 MHz (dependent on SoC SKU) to provide excellent overall performance.

An integrated Intel® 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and NC-SI. The Express-BD7 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BD7 has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC (or non-ECC) memory. Input/output features include 16 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port, USB 3.0/2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
"The information in this document provides a preview of the upcoming PICMG® COM.0 COM Express® Type 7 pinout. The pinout will officially launch with R3.0 of the specification later in 2016. The goal of this document is to provide COM Express module and carrier designers with information on the soon to be released Type 7 pinout so that potential users have the necessary design information." quoted from "PICMG® COM.0 COM Express™ Type 7 Preview"
Embedded Platforms and Modules for
Applications from the Fog to the Edge Computing (3.88 MB)

- Type 7, 6, 10 and 2
- Reference Carrier Boards and Starter Kit

Embedded Computer on Modules and Single Board Computers Catalog (2.67 MB)
- COM Express
- Qseven
- PC/104
- Mini-ITX
- PICMG 1.0
- PICMG 1.3

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COM Express Type 7: Bringing 16-core Server Grade Support and 10G to COM Express (1.4MB)"

Supports up to 16-core Server Grade Processors
ADLINK's first COM Express Type 7 product, the Express-BD7, is based on the Intel Xeon; processor D, available in 4, 8, 12, and 16-core versions for scalable computing performance. The Express-BD7 is suitable for space-constrained systems with increased density and reduced power consumption such as virtualization, edge computing or other numerical applications.

Bringing 10GbE to COM Express
One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. On the module they are implemented as 10GbE-KR, i.e. as single backplane lanes according to IEEE 802.3, paragraph 49. The physical implementation of the 10GbE interfaces takes place on the carrier board itself. Developers can define the signal transmission as optical (SFP+), copper cable (T). This provides flexibility for new designs

Video DEMO

Innovation of COM Express Type 7

ADLINK showcasing COM Express Type 7 with 16-core Server Grade

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