CM1-86DX3 - Rugged Small Form Factor SBCs and Systems - PC/104 - ADLINK Technology
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CM1-86DX3

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PC/104 Single Board Computer with Vortex86DX3 System-on-Chip

Features
  • Ultra low power, DM&P Vortex86DX3 SoC
  • Full ISA bus support
  • 2GB soldered DDR3L
  • 1x GbE, 1x Fast Ethernet
  • SATA, CFast
  • VGA and 18/24-bit single channel TTL/TFT
  • Supports Smart Embedded Management Agent (SEMA) functions
      |  Datasheet |         

  Introduction  
  SEMA  
  Extreme Rugged  
  2017 Publication  
  Ordering Information  
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CoreMoCM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors. The CM1-86DX3 runs DOS, Win CE 6.0, WEC7, WES2009, WES7 and Linux operating systems. The Vortex86-DX3 SoC does have a simulated ACPI to support Windows 7. Nevertheless there are no S3 or S4 modes supported.

Smart Embedded Management Agent
Today's Embedded PC Systems need to provide both optimal performance and low power consumption. This can be difficult to accomplish without adequate control and system management tools to detect potential problems before they get out of hand. Similarly, systems must run stably and continuously, particularly in critical applications and severe environments with subject to extreme shock & vibration and extended temperatures.

To meet these requirements, a tool is needed which is able to monitor and gather performance and status necessary information from the hardware in a timely, flexible and precise manner. ADLINK's Smart Embedded Management Agent (SEMA) accomplishes these goals for you, the developer and end user. Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every new ADLINK computer-on-module (COM) and single board computer (SBCs) is equipped with a Board Management Controller (BMC) device supporting SEMA.

Initially designed for power sequencing tasks, the BMC has evolved to include many new and useful features through the years. Measuring the supply current to get a snapshot of the system??s power consumption is only one of the new capabilities. Being compatible with the latest Embedded Application Programming Interface specification (EAPI) reduces your effort to port existing calls to SEMA to nearly zero!

Interfacing the hardware to the operating system is one of SEMA's most important functions. The BMC first collects all relevant information from the chipset and other sources. Using the System Management Bus driver, the application layer fetches the data and presents it to the user. ADLINK also provides a ready-made application that shows the data in user-friendly graphic interfaces, suitable for supervision and troubleshooting. (Learn More)

Our Rugged and Extreme Rugged™ products are developed using our Extreme Rugged™ Development Guidelines and Design Rules, and subjected to extensive voltage and temperature margin tests during the new product development process, in addition to Highly Accelerated Life Test (HALT) and shock and vibration testing. The ruggedness and reliability of the design is then validated using HALT, shock & vibration testing and voltage margining. This thorough testing regimen allows us to verify that ADLINK products meet the stringent requirements demanded by our customers.

- Highly Accelerated Life Test
- HALT
- Shock & Vibration
- Voltage and Temperature Margin Test
- Extended Temperature Testing
- Design Check
- Engineering Verification
- Pilot Run
- ETT Production Screening
- Conformal Coating
- Extended Life Cycle



Publication Download:
Rugged development requires integration of design and test from start to finish (1.99MB)


Designed for harsh environments and extended temperature (1.04MB)



Embedded Computer on Modules and Single Board Computers Catalog (2.67 MB)
- COM Express
- SMARC
- Qseven
- ETX
- PC/104
- Mini-ITX
- ATX
- PICMG 1.0
- PICMG 1.3


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