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Rugged Finned-convection System with 3rd Gen Intel® Core™ i7 Processor and MIL-STD-38999 High Speed Connectors

  • High speed eSATA, USB 3.0
  • VITA 75.21 mount with passive cooling
  • Intel® Core™ i7 dual or quad core Processor
  • Soldered DDR3L-1333 8GB, up to 16GB RAM
  • Quad Gigabit Ethernet
  • Available GPGPU on 16-lane 3rd Generation PCI Express
  • Dual independent displays (HDMI/DVI/VGA)
  • Rugged operating temperature: -40°C to +75°C
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Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

ADLINK Launches Compact, Military Grade HPERC-IBR-H Series Rugged Systems for Mission & Payload Computing

Smallest VITA 75 compliant system on the market offers high performance graphics processing for ground, air vehicle applications


[ 2015/03/31 ]
ADLINK Technology, a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced release of the compact, Extreme Rugged™ HPERC-IBR-H Series military grade system in a sealed, IP67-rated enclosure featuring high speed MIL-DTL-38999 connectors. At just 63.5/100mm (2.5/3.9 inch) x 150mm (5.9 inch) x 203mm (8.0 inch), the HPERC-IBR-H Series is a highly integrated, compact VITA 75 compliant unit almost 30% smaller than other leading competitive products1. The HPERC-IBR-H Series meets SWaP (Size, Weight and Power) requirements for modern military applications, with a focus on sensor data display, command, and control for mission computing in military ground or naval vehicles and mass image acquisition and processing for payload computing in UAVs.

The HPERC-IBR-H Series is a follow-on to ADLINK"s HPERC-IBR-M Series and features two models, the HPERC-IBR-HC coldplate mount system and the HPERC-IBR-HH finned-convection systems. Both units offer dual- or quad-core Intel® Core™ i7 processor technology and optional GPGPU parallel processing engine on a 16-lane 3rd generation PCI Express interface, as well as DDR3L-1333 ECC soldered down memory up to 16GB. The Extreme Rugged™ system also includes dual removable solid state drives, as well as four USB 3.0, two USB 2.0, four GigE, seven Serial (RS-232/422/485), and one VGA plus three digital video HDMI/DisplayPort/DVI interfaces. The HPERC-IBR-H Series provides expansion options to support fast and easy integration of additional interface cards such as PCI/104-Express and Mini PCI Express.

"The HPERC-IBR-H Series offers intense capabilities in a compact form factor, leveraging high performance graphics capabilities and a wealth of I/O support for camera and vehicle data busses," said Yong Luo, general manager of ADLINK"s Embedded Computing Product Segment. "This tightly integrated solution offers equivalent or better performance than competitive systems in a smaller footprint, with space requirements being a critical component of any successful in-vehicle military applications."

To endure harsh environments, the HPERC-IBR-H Series was developed using ADLINK"s Rugged by Design methodology to withstand extreme shock, corrosion and galvanic oxidation. The HPERC-IBR offers flexible cooling options: the HPERC-IBR-HC (-40°C to +85°C) for cold-plate cooling, and the HPERC-IBR-HH (-40°C to +75°C) designed for natural convection cooling.

The ADLINK HPERC Series is compliant to VITA 75 20/21/22 small form factor mounting and provides a wide array of fast I/O via MIL-DTL-38999 connectors. Additional expansion interfaces to meet the demands of various sensor suites are easily added with user-defined I/O pins.

UGV Requirements Push Evolution in HPEC Performance

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UGV Requirements Push Evolution in HPEC Performance (3.96MB)

As modern warfare changes, so must the technical innovations from global defense sector technology partners. The changing face of military engagements, fewer troops on the ground, more use of reconnaissance gathered via autonomous vehicles, real-time feeds to operations and the emergence of network-centric warfare are driving the solutions and applications needed to better support today's warfighter.

Payload and Mission Computing Requirements

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Payload and Mission Computing Requirements (3.08MB)

  • High Performance Rugged Computing Solutions that Meet or Exceed the Payload Computing Requirements
  • Products for Mobile Mission Computers, Ranging from Single Board Computers (SBCs) through to Complete Embedded Systems

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