Express-HLE - Computer-on-Modules - COM Express Type 6-Basic - ADLINK Technology
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Express-HLE

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COM Express Basic Size Type 6 Module with 4th Generation Intel Core i7/i5/i3 Processor with ECC memory (codename: Haswell)

Features
  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Dual channel 1600/1333 MHz DDR3L up to 16GB with ECC support in dual SODIMM sockets
  • Three DDI ports support 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
      |  Datasheet |  Other Documents |        

  Introduction  
  SEMA®  
  2017 Publication  
  Ordering Information  
NEWS!
Cornell University Attempts Fourth Straight Victory With Autonomous Underwater Vehicle Powered by ADLINK's Express-HL COM Express. --- 2015 July



The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

The Express-HLE features the Intel Core i7/i5/i3 processor supporting Intels Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance with ECC memory supported. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel QM77 Express chipset.

Integrated Intel Generation 7.5 includes features such as OpenGL 3.1, DirectX11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort. The Express-HLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-HLE has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel Mobile QM87 Express chipset integrates VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express? x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express connectivity.

The Express-HLE features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.


Smart Embedded Management Agent
Today"s Embedded PC Systems need to provide both optimal performance and low power consumption. This can be difficult to accomplish without adequate control and system management tools to detect potential problems before they get out of hand. Similarly, systems must run stably and continuously, particularly in critical applications and severe environments with subject to extreme shock & vibration and extended temperatures.

To meet these requirements, a tool is needed which is able to monitor and gather performance and status necessary information from the hardware in a timely, flexible and precise manner. ADLINK"s Smart Embedded Management Agent (SEMA) accomplishes these goals for you, the developer and end user. Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every new ADLINK computer-on-module (COM) and single board computer (SBCs) is equipped with a Board Management Controller (BMC) device supporting SEMA.

Initially designed for power sequencing tasks, the BMC has evolved to include many new and useful features through the years. Measuring the supply current to get a snapshot of the system??s power consumption is only one of the new capabilities. Being compatible with the latest Embedded Application Programming Interface specification (EAPI) reduces your effort to port existing calls to SEMA to nearly zero!

Interfacing the hardware to the operating system is one of SEMA"s most important functions. The BMC first collects all relevant information from the chipset and other sources. Using the System Management Bus driver, the application layer fetches the data and presents it to the user. ADLINK also provides a ready-made application that shows the data in user-friendly graphic interfaces, suitable for supervision and troubleshooting. (Learn More)

Embedded Platforms and Modules for
Applications from the Fog to the Edge Computing (3.88 MB)

- Type 7, 6, 10 and 2
- Reference Carrier Boards and Starter Kit



Embedded Computer on Modules and Single Board Computers Catalog (2.67 MB)
- COM Express
- SMARC
- Qseven
- ETX
- PC/104
- Mini-ITX
- ATX
- PICMG 1.0
- PICMG 1.3


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