The cExpress-HL is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 ULT Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i7/i5/3 ULT System-on-Chip, the cExpress-HL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.
The cExpress-HL features the Intel® Core™ i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance. Integrated Intel Generation 7.5 Graphics includes features such as OpenGL 3.1, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS and two DDI ports supporting HDMI / DVI / DisplayPort. The cExpress-HL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their
systems for reduced development time.
The cExpress-HL features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
ADLINK computer-on-modules products built in with SEMA Cloud can serve as an ideal gateway or platform for the Internet of Things applications. It enables the connectivity of legacy industrial devices and other systems to the IoT, extracts raw data from these devices, determines which data to save and which to send to the could for further analyses, and the results of data analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Today's Embedded PC Systems need to provide both optimal performance and low power consumption. This can be difficult to accomplish without adequate control and system management tools to detect potential problems before they get out of hand. Similarly, systems must run stably and continuously, particularly in critical applications and severe environments with subject to extreme shock & vibration and extended temperatures.
To meet these requirements, a tool is needed which is able to monitor and gather performance and status necessary information from the hardware in a timely, flexible and precise manner. ADLINK's Smart Embedded Management Agent (SEMA) accomplishes these goals for you, the developer and end user. Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every new ADLINK computer-on-module (COM) and single board computer (SBCs) is equipped with a Board Management Controller (BMC) device supporting SEMA.
Initially designed for power sequencing tasks, the BMC has evolved to include many new and useful features through the years. Measuring the supply current to get a snapshot of the system??s power consumption is only one of the new capabilities. Being compatible with the latest Embedded Application Programming Interface specification (EAPI) reduces your effort to port existing calls to SEMA to nearly zero!
Interfacing the hardware to the operating system is one of SEMA's most important functions. The BMC first collects all relevant information from the chipset and other sources. Using the System Management Bus driver, the application layer fetches the data and presents it to the user. ADLINK also provides a ready-made application that shows the data in user-friendly graphic interfaces, suitable for supervision and troubleshooting. (Learn More)
COM Express® Compact Size Type 6 Module with Intel® Core™ i3-4010U at 1.7 GHz with GT2 level graphics
COM Express® Compact Size Type 6 Module with Intel® Core™ i5-4300U at 1.9 GHz with GT2 level graphics
COM Express® Compact Size Type 6 Module with Intel® Core™ i7-4650U at 1.7 GHz with GT3 level graphics
COM Express® Compact Size Type 6 Module with Intel® Celeron® 2980U with 1.6GHz ULV 15W 2+1F and HD graphics
Heatspreader for cExpress-HL with threaded standoffs for bottom mounting
Heatspreader for cExpress-HL with through hole standoffs for top mounting
Low profile heatsink for cExpress-HL with threaded standoffs for bottom mounting
Low profile heatsink for cExpress-HL with through hole standoffs for top mounting
High profile heatsink for cExpress-HL with threaded standoffs for bottom mounting
High profile heatsink with Fan for cExpress-HL with threaded standoffs for bottom mounting