The Express-HL is a COM Express® COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 or Celeron processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM87 or HM86 Express chipset, the ExpressHL is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.
The Express-HL features the Intel® Core™ i7/i5/i3 or Celeron processor supporting Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and
DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media
Interface provide high speed connectivity to the Intel® QM77or HM86 Express chipset.
Integrated Intel Generation 7.5 includes features such as OpenGL 3.1, DirectX11, Intel® Clear Video HD Technology, Advanced Scheduler
2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs
include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort. The Express-HL is specifically designed for
customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for
reduced development time.
The Express-HL has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel® Mobile QM87 or HM86 Express chipset integrates
VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16
Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity.
The Express-HL features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, and 4 SATA 6 Gb/s ports.
Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features
such as remote console, CMOS backup, hardware monitor, and watchdog timer.
ADLINK computer-on-modules products built in with SEMA Cloud can serve as an ideal gateway or platform for the Internet of Things applications. It enables the connectivity of legacy industrial devices and other systems to the IoT, extracts raw data from these devices, determines which data to save and which to send to the could for further analyses, and the results of data analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Today''''''''s Embedded PC Systems need to provide both optimal performance and low power consumption. This can be difficult to accomplish without adequate control and system management tools to detect potential problems before they get out of hand. Similarly, systems must run stably and continuously, particularly in critical applications and severe environments with subject to extreme shock & vibration and extended temperatures.
To meet these requirements, a tool is needed which is able to monitor and gather performance and status necessary information from the hardware in a timely, flexible and precise manner. ADLINK''''''''s Smart Embedded Management Agent (SEMA) accomplishes these goals for you, the developer and end user. Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every new ADLINK computer-on-module (COM) and single board computer (SBCs) is equipped with a Board Management Controller (BMC) device supporting SEMA.
Initially designed for power sequencing tasks, the BMC has evolved to include many new and useful features through the years. Measuring the supply current to get a snapshot of the system��s power consumption is only one of the new capabilities. Being compatible with the latest Embedded Application Programming Interface specification (EAPI) reduces your effort to port existing calls to SEMA to nearly zero!
Interfacing the hardware to the operating system is one of SEMA''''''''s most important functions. The BMC first collects all relevant information from the chipset and other sources. Using the System Management Bus driver, the application layer fetches the data and presents it to the user. ADLINK also provides a ready-made application that shows the data in user-friendly graphic interfaces, suitable for supervision and troubleshooting. (Learn More)
COM Express® Basic Size Type 6 Module with Intel® Core™ i7-4700EQ at 2.4/1.7 GHz with GT2 level graphics
COM Express® Basic Size Type 6 Module with Intel® Core™ i5-4400E at 2.7 GHz with GT2 level graphics
COM Express® Basic Size Type 6 Module with Intel® Core™ i5-4402E at 1.6 GHz with GT2 level graphics
COM Express® Basic Size Type 6 Module with Intel® Core™ i3-4100E at 2.4 GHz with GT2 level graphics
COM Express® Basic Size Type 6 Module with Intel® Core™ i3-4102E at 1.6 GHz with GT2 level graphics
COM Express Basic Size Type 6 Module with Intel Core i7-4860EQ at 1.8GHz with GT3 level graphics and QM87 Chipset
COM Express® Basic Size Type 6 Module with Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1)
COM Express® Basic Size Type 6 Module with Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1)
Heatspreader for Express-HL with threaded standoffs for bottom mounting
Heatspreader for Express-HL with through hole standoffs for top mounting
Low profile heatsink for Express-HL with threaded standoffs for bottom mounting
Low profile heatsink for Express-HL with through hole standoffs for top mounting
High profile heatsink for Express-HL with threaded standoffs for bottom mounting
High profile heatsink with Fan for Express-HL with threaded standoffs for bottom mounting