CoreModule 920 - Rugged Small Form Factor SBCs and Systems - PCI/104-Express - ADLINK Technology
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ADLINK Extreme Rugged


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CoreModule 920

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Extreme Rugged™ PCI/104-Express Single Board Computer with 3rd Generation Intel® Core™ Processor

Features
  • Dual-core 3rd Generation Intel® Core™ Processor
  • Up to 4GB industrial grade solder down ECC 1600MHz DDR3 memory
  • One HDMI, one VGA, and one 18/24-bit LVDS display interfaces
  • 8GB industrial grade Solid State Disk
  • One PCIe x16 (Gen 3) and 1 x4 or 4 x1 (Gen 2)
  • Two SATA 6 Gb/s ports, two Gigabit Ethernet, four USB 2.0 interfaces, and two serial ports
  • PCI/104-Express Type 1 and PCI/104 expansion interfaces
  • Extreme Rugged™ operating temperature: -40°C to +85°C
      |  Datasheet |         

  Introduction  
  Extreme Rugged  
  2017 Publication  
  Ordering Information  
The ADLINK™ CoreModule® 920 is a PCI/104-Express SBC (Type 1) based on the 3rd generation Intel® Core™ i7?3517UE processor and provides the highest level of performance for our PC/104 product family.

The PCI/104-Express stackable form factor supports both PCIe and PCI bus connectivity and allows customers to build low power solutions for space constrained, extreme rugged environments.

The CoreModule® 920 is equipped with the Intel® Core™ i7?3517UE processor and Mobile Intel® QM67 Express Chipset to provide support for up to 4 GB DDR3 industrial grade soldered SDRAM at 1066/1333 MHz, 18/24-bit LVDS, HDMI and VGA display output, 8GB of industrial grade SSD, 2x SATA 6 Gb/s, 4x USB and 2x GbE.

Customized BIOS capabilities enable the system to underclock the CPU and reduce total power consumption for applications with limited thermal envelopes. Total board power can be reduced to 10 watts by reducing the CPU speed or running only a single core for low power applications. The CoreModule® 920 is particularly well suited to meet the size, performance, temperature range, quality, and reliability demands of mission critical land and airborne transport applications.
Our Rugged and Extreme Rugged™ products are developed using our Extreme Rugged™ Development Guidelines and Design Rules, and subjected to extensive voltage and temperature margin tests during the new product development process, in addition to Highly Accelerated Life Test (HALT) and shock and vibration testing. The ruggedness and reliability of the design is then validated using HALT, shock & vibration testing and voltage margining. This thorough testing regimen allows us to verify that ADLINK products meet the stringent requirements demanded by our customers.

- Highly Accelerated Life Test
- HALT
- Shock & Vibration
- Voltage and Temperature Margin Test
- Extended Temperature Testing
- Design Check
- Engineering Verification
- Pilot Run
- ETT Production Screening
- Conformal Coating
- Extended Life Cycle


Publication Download:
Rugged development requires integration of design and test from start to finish (1.99MB)


Designed for harsh environments and extended temperature (1.04MB)



Embedded Computer on Modules and Single Board Computers Catalog (2.67 MB)
- COM Express
- SMARC
- Qseven
- ETX
- PC/104
- Mini-ITX
- ATX
- PICMG 1.0
- PICMG 1.3


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