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COM Express Basic Size Type 7 Module with Up to 16 cores Intel® Xeon D and Pentium® D SoC (formerly codename: Broadwell-DE)

  • 最大16コア Intel® Xeon® D SoC
  • 最大32GBメモリ、デュアル・チャンネルDDR4 2400MHz ECC対応
  • 2つの10Gイーサネット、 NC-SI対応
  • 最大8つのPCIe x1 (第2世代)、 1つのPCIe x16 (第3世代)
  • GbE, four SATA 6 Gb/s, four USB 3.0/2.0
  • SEMA(Smart Embedded Management Agent)機能対応
  • 動作温度 :-40℃~85℃ (オプション)
      |  Datasheet |  Other Documents |        

  Pinout Preview  
  2017 Publication  
  Free Whitepaper  
  Ordering Information  
The COM Express standard new Type 7 pinout, as compared to the Type 6 pinout, does away with all graphics support and replaces it with up to four 10GbE ports and an additional eight PCI Express (PCIe) ports, bringing the total PCIe support to up to 32 PCIe lanes. The Type 7 pinout has been specifically tailored to leverage all the functions of low power, headless server-grade System-on-Chips (SoCs) with a TDP below 65 Watts. In addition, the Type 7 pinout brings out 10GBase-KR signals, meaning the carrier board designer can choose between KR-to-KR, KR-to-optical fiber or KR-to-copper. A Network Controller Sideband Interface (NC-SI) bus is also supported, allowing for Intelligent Platform Management Interface (IPMI) Board Management Controller (BMC) support on the carrier board.

"On-going updates are critical to enable full-featured designs using any open specification, particularly one as accepted in the embedded vendor community as COM Express said Joe Pavlat, president and chairman of the PICMG consortium. "We greatly appreciate the active participation of members like ADLINK to lead these efforts.

The preview of PICMG?s COM Express 3.0 Type 7 pinout definition is available for download to PICMG members on the PICMG website at

For more information COM Express 3.0 Type 7, please visit
"The information in this document provides a preview of the upcoming PICMG® COM.0 COM Express® Type 7 pinout. The pinout will officially launch with R3.0 of the specification later in 2016. The goal of this document is to provide COM Express module and carrier designers with information on the soon to be released Type 7 pinout so that potential users have the necessary design information." quoted from "PICMG® COM.0 COM Express™ Type 7 Preview"
Embedded Platforms and Modules for
Applications from the Fog to the Edge Computing (3.88 MB)

- Type 7, 6, 10 and 2
- Reference Carrier Boards and Starter Kit

Embedded Computer on Modules and Single Board Computers Catalog (2.67 MB)
- COM Express
- Qseven
- PC/104
- Mini-ITX
- PICMG 1.0
- PICMG 1.3

Click to download
COM Express Type 7: Bringing 16-core Server Grade Support and 10G to COM Express (1.4MB)"

Supports up to 16-core Server Grade Processors
ADLINK's first COM Express Type 7 product, the Express-BD7, is based on the Intel Xeon; processor D, available in 4, 8, 12, and 16-core versions for scalable computing performance. The Express-BD7 is suitable for space-constrained systems with increased density and reduced power consumption such as virtualization, edge computing or other numerical applications.

Bringing 10GbE to COM Express
One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. On the module they are implemented as 10GbE-KR, i.e. as single backplane lanes according to IEEE 802.3, paragraph 49. The physical implementation of the 10GbE interfaces takes place on the carrier board itself. Developers can define the signal transmission as optical (SFP+), copper cable (T). This provides flexibility for new designs

Video DEMO
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ADLINK showcasing COM Express Type 7 with 16-core Server Grade Support and 10GbE at IDF 2016

ADLINK showcasing COM Express Type 7 with 16-core Server Grade Support and 10GbE at IDF 2016

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Innovation of COM Express Type 7

Innovation of COM Express Type 7

Innovation of COM Express Type 7

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