Express-BL - Computer-on-Modules - COM Express Type 6-Basic - ADLINK Technology

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Express-BL

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COM Express Basic Size Type 6 Module with 5th Gen Intel Core and Xeon Processors (codename: Broadwell)

Features
  • 第5世代Intel Core & Xeonプロセッサ
  • 32GBデュアルチャネルDDR3L 1600MHzを搭載可能
  • DDIチャンネル x3、LVDS x1、VGA x1、3つの独立したディスプレイをサポート
  • PCIe x1 x7, PCIe x16 x1
  • GbE LAN、SATA 6Gb/s x4、USB 3.0 x4、USB 2.0 x4
  • Smart Embedded Management Agent (SEMA)機能対応
  • 拡張動作時温度:-40℃~85℃ (オプション)
     Datasheet |  Other Documents |        

  Introduction  
  2016 Publication  
  SEMA Cloud  
  Medical  
  Ordering Information  
The Express-BL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 and Xeon® E3-1200L v4 processors (codename "Broadwell") with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.

The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset.

Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BL has dual stacked SODIMM sockets for up to 32 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Innovative Embedded Platforms
with Longevity and
Form Fit Functions Principles (11.89 MB)

- Type 7, 6, 10 and 2
- Basic, Compact and Mini sizes
- Carrier boards and Starter kits



Embedded Modules and
Board Computers (18.89 MB)
- COM Express
- SMARC
- Qseven
- ETX
- PC/104
- Mini-ITX

An Intelligent Cloud Solution for Remote Monitoring, Management and Control

Downtime of devices or systems is not acceptable in today's industries. To help customers to analyze their systems and take counter measures for preventive maintenance, ADLINK has developed a tool which is able to monitor and collect system performance and status information from the hardware in a timely, flexible and precise manner: the Smart Embedded Management Agent (SEMA).

By combining SEMA intelligent middleware with cloud connectivity, ADLINK takes remote management technology a step further than previous generations. By employing full connectivity, from edge to cloud to end application, SEMA-enabled embedded devices can connect to the cloud without additional design requirements. Pushing data to the cloud enables operators to verify, monitor and control system performance from a single, central location improving reliability and reducing management costs.

- Manage and control all devices with one click
- Avoid system downtime with predictive maintenance
- Reduce total cost of ownership

(Learn More)
Among the most valuable developments in today's medical technology is the new generation of ultrasound imaging devices. Medical imaging quality improvement has long been a priority for technologists, with the goal to enable more accurate diagnosis through more detailed visualization. Incremental advancements have been seen over the past decades, creating a constant improvement in patient care.


Publication Download:
ADLINK Computer-on-Modules Boost Improvements in Ultrasound Technology (2.69MB)


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