ADLINK Home Products Computer On Modules COM Express

Build Your Internet of Things Enabled by
Industrial-grade Computer on Modules

Efficient COMs for your
fanless mobile medical device

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COM Express Compact Size Type 6 5th Gen Intel® Core™ Processor i7/i5/i3

Finding the right form factor for your application?

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Full range of 4th Gen Intel Core modules for your automation applications

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COM Express was developed and is maintained by PICMG (PCI Industrial Computer Manufacturers Group). COM Express was released in the summer of 2005 and is the most widely used COM standard. The standard defines the physical size, interconnect, and thermal interface for a COM.The original COM Express specification was written to support peripherals that were available at the time of release - including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, SDVO, PCI, and PCI Express Gen 1. Several pinout types were defined by PICMG with each one having a specific combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express module is a type 2, followed by type 1.

With the introduction of new display interfaces in the embedded market such as HDMI and Displayport it was time for a major upgrade of the COM Express specification. In the summer of 2010. The updated specification was called "PICMG® COM.0 rev 2.0". and defined a new type 6 that allowed for HDMI, DVI and Displayport display interfaces, for USB 3.0 and for more PCI Express lanes. Besides the pinout changes two more form factors where formalized : COMPACT (95x95mm) and Mini (84x55mm).

The ADLINK computer-on-modules with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. ADLINK COM Express modules are able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

  Type 6  
  Type 2  
  Type 10 mini-size  

Basic Size (125 x 95 mm)

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COM Express Basic Size Type 6 Module with 5th Gen Intel® Core® and Xeon® Processors (formerly codename Broadwell-H)

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COM Express® Basic Size Type 6 Module with AMD® Embedded R-Series APU (formerly codename Bald Eagle)

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COM Express Basic Size Type 6 Module with 4th Gen Intel Core or Celeron Processors (formerly codename Haswell)

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COM Express Basic Size Type 6 Module with 4th Generation Intel Core i7/i5/i3 Processor with ECC memory

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COM Express® Basic Size Type 6 Module with 3rd Generation Intel® Core™ i7/i5/i3 Processor

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Extreme Rugged™ COM Express® Type 6 Computer-on-Module with 3rd Generation Intel® Core™ Processor and QM77 Chipset

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COM Express® Type 6 Module with Second Generation Intel® Core™ i7/i5/i3 processor and Mobile Intel QM67 Chipset

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Extreme Rugged™ COM Express® Type 6 Computer-on-Module with Intel® Core™ i7 processor and QM67 Chipset

Compact (95 x 95 mm)

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COM Express Compact Size Type 6 Module with Intel® Pentium® and Celeron® N3000 Series SoC (formerly codename Braswell)

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COM Express® Compact Size Type 6 Module with 5th Gen Intel® Core™ i7/i5/i3 SoC (formerly codename Broadwell)

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COM Express® Compact Size Type 6 Module with 4th Gen Intel® Core™ i7/i5/i3 Processors

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COM Express Compact Size Type 6 Module with Intel® Atom™ or Intel® Celeron® Processor System-on-Chip

Accessory 

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COM Express® Type 6 Reference Carrier Board in ATX Form Factor

COM Express Type 6 Starter kit

 
COM Express Type 6 Starter Kit Plus 
COM Express Type 6 Starter Kit Plus


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Featured Video


ADLINK Com Express Module Supporting Cornell University at 2015 AUVSI RoboSub Competition


Resource
Increased processing power and graphics performance in small form factor modules drives imaging advances and increased mobility in ultrasound devices
Rugged development requires integration of design and test from start to finish
COM Express Modules Flyer


SEMA Cloud
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